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DSPIC33FJ64GS606-E/MR

Microchip Technology

DSPIC33FJ64GS606-E/MR by Microchip Technology

DSPIC33FJ64GS606-E/MR by Microchip is a 16-bit DSP with 3.3V supply, 40MHz clock frequency, and flash ROM programmability. Ideal for automotive applications, it operates b/w -40 to 125°C, has a quad terminal position, and comes in a square chip carrier package.

Median Price

$7.990

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,200 parts In-Stock

1+ parts

$7.990

100+ parts

$6.590

1k+ parts

$6.050

10k+ parts

$5.770

1,200

$7.990

$6.590

$6.050

$5.770

Mouser Electronics

USA . 115 parts In-Stock

1+ parts

$7.990

100+ parts

$7.250

1k+ parts

$6.590

10k+ parts

-

115

$7.990

$7.250

$6.590

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$7.147

100+ parts

-

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150

$7.147

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NAC Semi

USA . 960 parts In-Stock

1+ parts

$8.250

100+ parts

$7.480

1k+ parts

$6.840

10k+ parts

-

960

$8.250

$7.480

$6.840

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Vyrian

USA . 8,740 parts In-Stock

1+ parts

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8,740

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SIE Connect GmbH - GreenChips

Germany . 499 parts In-Stock

1+ parts

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499

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LIBRA Elektronik GmbH

Germany . 293 parts In-Stock

1+ parts

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293

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Greenchips

USA . 280 parts In-Stock

1+ parts

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280

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Prism Electronics

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 605 parts In-Stock

1+ parts

$6.790

100+ parts

-

1k+ parts

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10k+ parts

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605

$6.790

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Semicontronic

India . 425 parts In-Stock

1+ parts

$6.790

100+ parts

$6.620

1k+ parts

$6.586

10k+ parts

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425

$6.790

$6.620

$6.586

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Continental Prestige Electronics

USA . 2,946 parts In-Stock

1+ parts

$7.147

100+ parts

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1k+ parts

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10k+ parts

$7.004

2,946

$7.147

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-

$7.004

Lixinc

USA . 9,381 parts In-Stock

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9,381

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Marpe Global Electronics

Taiwan . 6,629 parts In-Stock

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6,629

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QualityLine Systems

Poland . 6,629 parts In-Stock

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6,629

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XL Components Corporation

Australia . 6,629 parts In-Stock

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6,629

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Argo Parts USA

USA . 2,193 parts In-Stock

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2,193

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$7.004

1k+ parts

$6.790

10k+ parts

$6.647

50

-

$7.004

$6.790

$6.647

Perfect Parts

USA . 50 parts In-Stock

1+ parts

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50

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Overview

Elevate your projects to the next level with the DSPIC33FJ64GS606-E/MR by Microchip Technology. As a pioneer in the field of Digital Signal Processors, Microchip Technology delivers cutting-edge technology and unmatched quality. This versatile chip is ideal for a wide range of applications, offering customers unparalleled value and performance. With its impressive features and reliability, the DSPIC33FJ64GS606-E/MR is sure to exceed your expectations and help you achieve your goals. Elevate your projects to the next level with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product affordable and long-lasting.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly of the product onto circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various system requirements.

Package Shape: SQUARE

The square shape of the package helps in space-saving designs and efficient utilization of board real estate.

Bit Size: 16

The 16-bit size allows for higher precision and accuracy in processing digital signals, enhancing the overall performance of the product.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard power sources, making integration into existing systems straightforward.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with other components, enabling versatile applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles allows for efficient heat dissipation and compact designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and reliable operation within a wide range of power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain performance under stress.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, expanding the product's range of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring secure and durable connections.

Terminal Position: QUAD

The quad terminal position enables easy and secure mounting on circuit boards, simplifying the assembly process.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact designs and efficient use of vertical space in electronic devices.

Width: 9 mm

With a width of 9mm, the product is suitable for applications where space constraints are a consideration, such as portable devices.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz enables fast processing of digital signals, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature allows for efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand the soldering process without compromising its integrity.

Length: 9 mm

The 9mm length offers a compact form factor, making the product suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Being rated for automotive temperature requirements ensures reliability and performance in automotive applications, where temperature fluctuations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The combination of digital signal processor and controller functionalities allows for versatile signal processing and control capabilities in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of lead contamination, promoting environmental sustainability.

Maximum Supply Current: 170 mA

With a maximum supply current of 170 mA, the product operates efficiently without drawing excessive power, extending battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable and consistent power delivery, enhancing the reliability and performance of the product.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and flexible firmware updates, enabling customization and future-proofing of the product.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch facilitates high-density mounting, making the product suitable for applications where space-saving is crucial.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during storage and assembly processes.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS606-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ64GS606-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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