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DSPIC33EV128GM106T-I/MR

Microchip Technology

DSPIC33EV128GM106T-I/MR by Microchip Technology

DSPIC33EV128GM106T-I/MR by Microchip Technology is a 16-bit DSP with 131072 ROM words, 8192 RAM words, and 36-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring high-speed processing (40 MHz) and low power consumption (350 mA). Connectivity options include CAN, I2C, SPI(2), UART(2), making it versatile for various control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,592 parts In-Stock

1+ parts

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6,592

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Nova Conductors

Japan . 90 parts In-Stock

1+ parts

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,570 parts In-Stock

1+ parts

$5.000

100+ parts

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1,570

$5.000

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AZTECH Wire

Italy . 1,012 parts In-Stock

1+ parts

$20.940

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1,012

$20.940

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Corohmni

South Africa . 2,384 parts In-Stock

1+ parts

$29.492

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2,384

$29.492

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Continental Prestige Electronics

USA . 4,194 parts In-Stock

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4,194

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Fulton Briggs Corp.

USA . 3,890 parts In-Stock

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3,890

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Argo Parts USA

USA . 1,348 parts In-Stock

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1,348

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of cutting-edge technology with the DSPIC33EV128GM106T-I/MR by Microchip Technology. As a leader in the industry, Microchip guarantees top-notch quality and reliability. The Digital Signal Processor category offers endless possibilities in various applications. Experience unparalleled value with this product, providing customers with superior performance, efficiency, and versatility. Elevate your projects to new heights with the advantages and benefits that the DSPIC33EV128GM106T-I/MR brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and reducing the overall cost of production.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs for versatile applications.

Bit Size: 16

With a higher bit size, this DSP can handle more complex calculations and process data more efficiently, making it suitable for demanding tasks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining DSP and controller functions in one device provides versatility and functionality for various applications, simplifying system design.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for fast data processing and real-time operations, making it ideal for applications that require quick response times.

Connectivity: CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Multiple connectivity options enable seamless integration with various communication protocols, expanding compatibility with different systems and devices.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and customization, ensuring flexibility and adaptability to changing system requirements.

Analog To Digital Convertors: 36-Ch 12-Bit

Multiple high-resolution ADC channels ensure accurate and precise analog signal conversion, making the product suitable for applications requiring high-quality data acquisition.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV128GM106T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

36-Ch 12-Bit

Trade Compliance

DSPIC33EV128GM106T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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