Loading...

DSPIC33EP64GS808-E/PT

Microchip Technology

DSPIC33EP64GS808-E/PT by Microchip Technology

DSPIC33EP64GS808-E/PT by Microchip is a 16-bit DSP with 80 terminals, 3-3.6V supply, and 60MHz clock speed. Ideal for automotive applications, it features 22 ADC channels, 2 DAC channels, and peripherals like PWM(16) and TIMER(5).

Median Price

$8.040

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 357 parts In-Stock

1+ parts

$8.040

100+ parts

$6.680

1k+ parts

$6.130

10k+ parts

$5.840

357

$8.040

$6.680

$6.130

$5.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 238 parts In-Stock

1+ parts

$8.340

100+ parts

$7.560

1k+ parts

$6.910

10k+ parts

-

238

$8.340

$7.560

$6.910

-

Vyrian

USA . 8,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,038

-

-

-

-

Nova Conductors

Japan . 59 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

59

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,169 parts In-Stock

1+ parts

$6.819

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$6.819

-

-

-

Ampacity Inc.

Singapore . 27 parts In-Stock

1+ parts

$6.830

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$6.830

-

-

-

Component Stockers USA

USA . 1,563 parts In-Stock

1+ parts

$7.790

100+ parts

$6.480

1k+ parts

$5.940

10k+ parts

-

1,563

$7.790

$6.480

$5.940

-

AZTECH Wire

Italy . 207 parts In-Stock

1+ parts

$11.350

100+ parts

-

1k+ parts

-

10k+ parts

-

207

$11.350

-

-

-

West Coast Incorporated

USA . 6,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,043

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the DSPIC33EP64GS808-E/PT by industry leader Microchip Technology. As a top-of-the-line Digital Signal Processor (DSP), this innovative product offers unparalleled performance and reliability for a wide range of applications. With advanced features such as multiple peripherals, low power mode, and high clock frequency, this DSP delivers value and benefits beyond compare. Trust Microchip Technology to provide you with the quality and advantage you need to take your projects to the next level. Elevate your designs with the DSPIC33EP64GS808-E/PT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package of the DSP lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy assembly and integration into various electronic devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient storage and processing of data within the chip.

Screening Level: AEC-Q100; TS 16949

The AEC-Q100 and TS 16949 screening levels ensure high reliability and quality standards for automotive applications.

Package Shape: SQUARE

The square package shape provides a compact form factor for easy PCB layout and space-saving designs.

Bit Size: 16

With a 16-bit architecture, the DSP can handle complex calculations and processing tasks efficiently.

DAC Channels: YES

The presence of Digital-to-Analog Converter channels allows for analog signal output.

No. of Terminals: 80

The large number of terminals provides ample connectivity options for various interfaces and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style offers space-saving benefits and easier heat dissipation.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the DSP to withstand harsh environmental conditions.

No. of External Interrupts: 4

With 4 external interrupts, the DSP can efficiently handle external events and trigger specific actions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the DSP to process analog input signals.

DMA Channels: YES

The availability of Direct Memory Access channels allows for efficient data transfer between peripherals and memory.

Terminal Position: QUAD

The quad terminal position provides mechanical stability and ease of soldering during assembly.

ROM Words: 65536

With 65536 ROM words, the DSP can store a large amount of program code for execution.

Maximum Seated Height: 1.2 mm

The low maximum seated height ensures compatibility with slim and compact device designs.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP64GS808-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of I/O Lines:

67

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

DSPIC33EP64GS808-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20