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DSPIC33EP32GS502T-I/SO

Microchip Technology

DSPIC33EP32GS502T-I/SO by Microchip Technology

DSPIC33EP32GS502T-I/SO by Microchip is a 16-bit DSP with max clock freq of 60MHz. It operates in industrial temp range (-40 to 85°C) and has flash ROM programmability. Ideal for digital signal processing applications due to its CMOS technology and small outline package style.

Median Price

$5.664

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 87 parts In-Stock

1+ parts

$5.664

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87

$5.664

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Vyrian

USA . 5,403 parts In-Stock

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5,403

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,248 parts In-Stock

1+ parts

$5.664

100+ parts

-

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$5.550

1,248

$5.664

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$5.550

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.664

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50

$5.664

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AZTECH Wire

Italy . 760 parts In-Stock

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$5.685

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760

$5.685

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Ampacity Inc.

Singapore . 910 parts In-Stock

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$6.000

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910

$6.000

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Corohmni

South Africa . 39 parts In-Stock

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$17.204

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39

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Aztec Data Supply Inc.

USA . 1,303 parts In-Stock

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$49.126

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1,303

$49.126

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Argo Parts USA

USA . 4,147 parts In-Stock

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Fulton Briggs Corp.

USA . 1,968 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the DSPIC33EP32GS502T-I/SO by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-notch quality and reliability. With applications in various industries, this digital signal processor offers unmatched performance and efficiency. Experience the value of enhanced processing power, flexibility, and precision that this product brings to your projects. Upgrade to the DSPIC33EP32GS502T-I/SO and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protects the internal components of the DSP.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Screening Level: TS 16949

Compliance with TS 16949 ensures high quality and reliability in automotive systems.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Bit Size: 16

16-bit processing provides sufficient computational power for signal processing tasks.

No. of Terminals: 28

A higher number of terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package maximizes space efficiency on the PCB.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and prevents oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers redundancy and improves signal integrity.

Maximum Seated Height: 2.65 mm

Low seated height allows for compact PCB design.

Width: 7.5 mm

Narrow width enables placement in tight spaces on the circuit board.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast signal processing and high-performance computing.

Maximum Time At Peak Reflow Temperature (s): 40

Supports quick and efficient solder reflow processes during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures proper soldering and reliability of the DSP.

Length: 17.9 mm

Optimal length for fitting into compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating allows for reliable operation in industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller capabilities offers versatile functionality for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration density.

Terminal Form: GULL WING

Gull wing terminal form allows for automated assembly and easy inspection.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance of the DSP.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and software configurations.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and reliable electrical connections.

On Chip Program ROM Width: 8

8-bit width of on-chip program ROM provides sufficient storage capacity for firmware and software.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP32GS502T-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC33EP32GS502T-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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