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DSPIC33EP256MC204-E/ML

Microchip Technology

DSPIC33EP256MC204-E/ML by Microchip Technology

DSPIC33EP256MC204-E/ML by Microchip Technology is a 16-bit DSP with 3.3V supply, 60MHz clock frequency, and 32768 RAM words. Ideal for automotive applications, it features CMOS technology, FLASH ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$4.675

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,260 parts In-Stock

1+ parts

$5.140

100+ parts

$4.280

1k+ parts

$3.950

10k+ parts

$3.740

1,260

$5.140

$4.280

$3.950

$3.740

Future Electronics

Canada . 3 parts In-Stock

1+ parts

-

100+ parts

$4.210

1k+ parts

$4.120

10k+ parts

-

3

-

$4.210

$4.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 990 parts In-Stock

1+ parts

$5.320

100+ parts

$4.830

1k+ parts

$4.410

10k+ parts

-

990

$5.320

$4.830

$4.410

-

Vyrian

USA . 7,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,720

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

IBS Electronics

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$5.905

1k+ parts

$5.778

10k+ parts

-

3

-

$5.905

$5.778

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 682 parts In-Stock

1+ parts

$3.610

100+ parts

-

1k+ parts

-

10k+ parts

-

682

$3.610

-

-

-

AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$14.010

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$14.010

-

-

-

XL Components Corporation

Australia . 8,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,052

-

-

-

-

Marpe Global Electronics

Taiwan . 4,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,818

-

-

-

-

QualityLine Systems

Poland . 1,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,442

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Upgrade your digital signal processing capabilities with the Microchip Technology DSPIC33EP256MC204-E/ML. Manufactured by a trusted industry leader, this powerful DSP offers exceptional performance in a compact package. Ideal for a wide range of applications, this DSP provides customers with unparalleled value and benefits. Unlock new possibilities and enhance your projects with the innovative features and advantages of the DSPIC33EP256MC204-E/ML. Trust Microchip Technology for quality solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for reliable operation within a safe voltage range, enhancing the overall performance and longevity of the product.

Bit Size: 16

With a larger bit size, the product can handle more complex processing tasks with higher precision and accuracy.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperature conditions, making it suitable for use in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC204-E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.32SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33EP256MC204-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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