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DSPIC33EP128GS702T-I/SO

Microchip Technology

DSPIC33EP128GS702T-I/SO by Microchip Technology

DSPIC33EP128GS702T-I/SO by Microchip Technology is a 16-bit DSP with 131072 ROM words, 8192 RAM words, and a max clock frequency of 60 MHz. Ideal for industrial applications, it features 11-Ch 12-Bit ADCs, CAN(2), I2C(2), SPI(3), UART(2) connectivity, and low power mode for efficient operation.

Median Price

$7.564

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.564

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100

$7.564

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Vyrian

USA . 8,212 parts In-Stock

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8,212

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,086 parts In-Stock

1+ parts

$4.000

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-

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1,086

$4.000

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AZTECH Wire

Italy . 791 parts In-Stock

1+ parts

$5.397

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791

$5.397

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Corohmni

South Africa . 33 parts In-Stock

1+ parts

$7.445

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33

$7.445

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Continental Prestige Electronics

USA . 5,855 parts In-Stock

1+ parts

$7.564

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$7.413

5,855

$7.564

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$7.413

RGB Technical Solutions

Ukraine . 3,673 parts In-Stock

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3,673

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Argo Parts USA

USA . 3,502 parts In-Stock

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3,502

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$7.413

1k+ parts

$7.186

10k+ parts

$7.035

100

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$7.413

$7.186

$7.035

Overview

Unlock the limitless possibilities of digital signal processing with the DSPIC33EP128GS702T-I/SO by Microchip Technology. Designed with precision and reliability in mind, this powerful device offers unmatched performance in a compact package. From industrial automation to consumer electronics, this digital signal processor caters to a wide range of applications with its advanced features and cutting-edge technology. Experience seamless connectivity, efficient power management, and high-speed data processing like never before. Elevate your projects to new heights with the DSPIC33EP128GS702T-I/SO and discover the true potential of digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the DSP.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Provides fast access to data within the chip for efficient processing.

DAC Channels: YES

Enables digital to analog conversion for interfacing with analog components.

No. of Terminals: 28

Offers multiple connection points for interfacing with external components.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating environments.

DMA Channels: YES

Enables Direct Memory Access for efficient data transfer.

ROM Words: 131072

Provides ample storage for program instructions.

Digital To Analog Convertors 1-Ch 12-Bit

Enables precise analog output.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for digital signal processing applications.

Analog To Digital Convertors 11-Ch 12-Bit

Allows for high-resolution analog to digital conversion.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS702T-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of I/O Lines:

20

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

DSPIC33EP128GS702T-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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