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DSPIC33EP128GP504-I/MV

Microchip Technology

DSPIC33EP128GP504-I/MV by Microchip Technology

DSPIC33EP128GP504-I/MV by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It features 16384 RAM words and operates in industrial temperature grades. This chip is ideal for applications requiring high-speed processing and low power consumption, such as digital signal processing and control systems.

Median Price

$3.948

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$3.948

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90

$3.948

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Vyrian

USA . 7,961 parts In-Stock

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7,961

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 353 parts In-Stock

1+ parts

$3.580

100+ parts

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353

$3.580

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Netroflash

USA . 500 parts In-Stock

1+ parts

$3.948

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500

$3.948

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AZTECH Wire

Italy . 203 parts In-Stock

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$16.286

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203

$16.286

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Microchip USA

USA . 1,285 parts In-Stock

1+ parts

$25.662

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1,285

$25.662

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Fulton Briggs Corp.

USA . 234 parts In-Stock

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234

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Overview

Unleash the full potential of your digital signal processing projects with the DSPIC33EP128GP504-I/MV by Microchip Technology. This top-of-the-line Digital Signal Processor offers unparalleled quality and reliability, backed by Microchip's reputation for excellence in manufacturing. Ideal for a wide range of applications, this DSP delivers exceptional value, benefits, and advantages to customers seeking high performance and precision in their designs. Upgrade your projects with the DSPIC33EP128GP504-I/MV and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable design, making it a suitable choice for portable or rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs, offering flexibility in various power supply configurations.

On Chip Data RAM Width: 8

The 8-bit width of the on-chip data RAM allows for efficient data processing and storage, enhancing the performance of the DSP.

Screening Level: TS 16949

The TS 16949 screening level indicates a high level of quality assurance, ensuring reliability and consistency in performance.

Package Shape: SQUARE

The square package shape provides a compact footprint, saving space on the PCB and making it ideal for size-constrained applications.

Bit Size: 16

With a 16-bit size, this DSP offers enhanced data processing capabilities, making it suitable for complex signal processing tasks.

No. of Terminals: 48

The 48 terminals provide ample connectivity options, allowing for versatile integration with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offered, including chip carrier, heat sink/slug, and very thin profile, cater to different application requirements, offering flexibility in design.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, offering versatility in power supply selection.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GP504-I/MV attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.55 mm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DSPIC33EP128GP504-I/MV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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