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DSPIC30F2011-30I/SO

Microchip Technology

DSPIC30F2011-30I/SO by Microchip Technology

DSPIC30F2011-30I/SO by Microchip is a 16-bit DSP with max clock freq of 40 MHz, operating temp range -40 to 85 °C. Ideal for industrial applications, it features flash ROM programmability, CMOS technology, and dual terminal position.

Median Price

$4.180

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 480 parts In-Stock

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$1.340

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$1.340

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Chip1Stop

Japan . 443 parts In-Stock

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$2.400

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$2.320

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RS Americas

USA . 480 parts In-Stock

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$4.180

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$4.180

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Microchip Technology

USA . 420 parts In-Stock

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$4.450

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$3.700

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$3.370

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$3.210

420

$4.450

$3.700

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$3.210

DigiKey

USA . 284 parts In-Stock

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$4.450

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$3.913

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$3.913

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Mouser Electronics

USA . 270 parts In-Stock

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$4.450

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$4.010

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$4.450

$4.010

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Verical

USA . 126 parts In-Stock

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$3.846

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$3.729

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$3.729

Distributors (In-Stock)

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Bristol Electronics

USA . 126 parts In-Stock

1+ parts

$7.007

100+ parts

$3.036

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126

$7.007

$3.036

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Vyrian

USA . 4,659 parts In-Stock

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4,659

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Dan-Mar Components

USA . 126 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,204 parts In-Stock

1+ parts

$2.870

100+ parts

$2.798

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$2.784

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1,204

$2.870

$2.798

$2.784

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Ampacity Inc.

Singapore . 750 parts In-Stock

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$3.090

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$3.090

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Corohmni

South Africa . 186 parts In-Stock

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$4.090

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$4.090

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Andel Nordic

Denmark . 4,450 parts In-Stock

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$10.011

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$9.610

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$9.610

4,450

$10.011

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$9.610

$9.610

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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QualityLine Systems

Poland . 3,635 parts In-Stock

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Continental Prestige Electronics

USA . 3,469 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Marpe Global Electronics

Taiwan . 2,703 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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XL Components Corporation

Australia . 1,457 parts In-Stock

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Perfect Parts

USA . 1,359 parts In-Stock

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Argo Parts USA

USA . 1,205 parts In-Stock

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Kepictronics

USA . 55 parts In-Stock

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Overview

Unlock the power of digital signal processing with the high-quality DSPIC30F2011-30I/SO by Microchip Technology. Designed for a wide range of applications, this digital signal processor offers unmatched performance and reliability. With its advanced technology and innovative features, customers can experience seamless operation and enhanced efficiency in their projects. Trust Microchip Technology for cutting-edge solutions that deliver exceptional value and benefits to meet all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the digital signal processor, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs, increasing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape is standard and makes it compatible with a wide range of mounting options and layouts.

Bit Size: 16

A 16-bit architecture allows for faster processing and more precision in calculations, making this DSP suitable for demanding tasks.

Power Supplies (V): 3/5

Support for multiple power supply voltages gives flexibility in design and compatibility with different systems.

No. of Terminals: 18

Having a sufficient number of terminals enables connections to various external components, expanding the functionality of the DSP.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB, making it ideal for compact designs while maintaining high performance.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures reliable operation even under varying input power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions and extended usage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without compromising performance.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting orientation and provide redundancy for increased reliability.

Maximum Seated Height: 2.64 mm

The low profile design with a maximum seated height enables compact and slim device designs.

Width: 7.49 mm

The narrow width of the DSP allows for efficient use of space on the PCB, especially in designs with tight constraints.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency allows for fast data processing and real-time operation in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time at peak temperature ensures reliable solder joints during assembly, reducing the risk of defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for lead-free soldering processes, complying with environmental regulations.

Length: 11.53 mm

The compact length of the DSP contributes to space-saving designs and compatibility with various mounting configurations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining DSP and controller functionality in one chip simplifies system design and reduces component count for cost-effective solutions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making this DSP suitable for battery-powered devices and efficient operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical attachment and facilitates automated assembly processes for high-volume production.

Nominal Supply Voltage: 5 V

With a standard nominal supply voltage of 5V, this DSP is compatible with many existing systems and power sources.

ROM Programmability: FLASH

Flash ROM programmability allows for firmware updates and customization, enhancing flexibility and adaptability in various applications.

Terminal Pitch: 1.27 mm

The narrow terminal pitch enables high-density mounting and efficient use of PCB space in compact designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and reduces computational complexity, improving efficiency in signal processing tasks.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate sensitivity to moisture, ensuring proper handling and storage to maintain the integrity of the DSP during assembly.

On Chip Program ROM Width: 24

The 24-bit wide on-chip program ROM provides ample storage for firmware and custom algorithms, enabling versatile functionality and customization.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2011-30I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.53 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

18

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.64 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.49 mm

Trade Compliance

DSPIC30F2011-30I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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