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DN3525N8-G

Microchip Technology

DN3525N8-G by Microchip Technology

DN3525N8-G by Microchip Technology is a N-CHANNEL FET for SWITCHING applications. It has a 250V DS Breakdown Voltage, 1A IDM, and 6 ohm RDS(on). Operating in DEPLETION MODE, it offers fast ton of 45ns and toff of 65ns. Ideal for small outline packages with -55 to 150 °C temp range.

Median Price

$0.876

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Arrow

USA . 3,772 parts In-Stock

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$0.855

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$0.816

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$0.777

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$0.764

3,772

$0.855

$0.816

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$0.764

Mouser Electronics

USA . 2,596 parts In-Stock

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$0.880

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Newark

USA . 103 parts In-Stock

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$0.906

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$0.773

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Element14

Singapore . 1,168 parts In-Stock

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$0.933

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$0.799

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Adafruit Industries

USA . 100 parts In-Stock

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$1.045

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$0.993

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$1.045

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Master Electronics

USA . 2,000 parts In-Stock

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$0.741

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$0.724

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Verical

USA . 2,000 parts In-Stock

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$0.872

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$0.861

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$0.861

Farnell

UK . 1,218 parts In-Stock

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$0.660

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$0.650

1,218

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$0.650

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.696

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50

$0.696

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Chip Stock

USA . 30,500 parts In-Stock

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Vyrian

USA . 14,320 parts In-Stock

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Electro Sonic

Canada . 8,000 parts In-Stock

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$0.610

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IBS Electronics

USA . 4,000 parts In-Stock

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$0.898

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$0.877

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$0.877

PC Components Company LLC

USA . 1,998 parts In-Stock

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Bristol Electronics

USA . 1,998 parts In-Stock

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Legend Electronics Inc.

USA . 699 parts In-Stock

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Resion

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Prism Electronics

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NexGen Digital

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,495 parts In-Stock

1+ parts

$0.510

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15,495

$0.510

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Semicontronic

India . 15,337 parts In-Stock

1+ parts

$0.510

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$0.497

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$0.495

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15,337

$0.510

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Component Stockers USA

USA . 339,928 parts In-Stock

1+ parts

$0.650

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$0.640

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$0.630

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$0.600

339,928

$0.650

$0.640

$0.630

$0.600

Argo Parts USA

USA . 3,065 parts In-Stock

1+ parts

$0.696

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$0.675

3,065

$0.696

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$0.675

Corohmni

South Africa . 268 parts In-Stock

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$0.827

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$0.827

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.045

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$0.993

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$0.993

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100

$1.045

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Aztec Data Supply Inc.

USA . 4,565 parts In-Stock

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$1.763

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Microchip USA

USA . 5,361 parts In-Stock

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$4.236

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Kepictronics

USA . 23,536 parts In-Stock

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Robosynatics

Brazil . 17,182 parts In-Stock

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$0.325

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$0.319

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$0.319

17,182

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$0.319

Lucentia Tech

USA . 17,182 parts In-Stock

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$0.325

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$0.319

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$0.319

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$0.319

Perfect Parts

USA . 12,162 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,198 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,975 parts In-Stock

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Lixinc

USA . 5,508 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,996 parts In-Stock

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$0.565

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$0.553

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Alle Elektronik GmbH

Germany . 3,983 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Eastek

USA . 2,000 parts In-Stock

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Computer Components Inc. - USA

USA . 1,725 parts In-Stock

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West Coast Incorporated

USA . 161 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.682

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$0.661

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$0.647

100

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$0.682

$0.661

$0.647

Overview

Experience unparalleled performance and reliability with the DN3525N8-G Power FET by Microchip Technology. This N-CHANNEL transistor is designed for switching applications, offering a built-in diode for added convenience. With a maximum operating temperature of 150°C and a minimum operating temperature of -55°C, this FET ensures optimal functionality in various conditions. Trust in Microchip Technology's expertise in semiconductor technology and enhance your electronic designs with the DN3525N8-G for efficient power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring its reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling of current in inductive loads, providing protection for the circuit and enhancing performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast switching speeds and low power dissipation, making it ideal for efficient power management.

Minimum DS Breakdown Voltage: 250 V

The high breakdown voltage allows for safe operation in higher voltage circuits, adding versatility to the FET's applications.

Surface Mount: YES

Being surface mount compatible makes installation easier and allows for a more compact and space-efficient design.

Maximum Pulsed Drain Current (IDM): 1 A

The high pulsed drain current rating enables the FET to handle short high current pulses without causing damage, expanding its range of applications.

Maximum Power Dissipation (Abs): 1.6 W

With a high power dissipation capability, this FET can handle moderate power levels without overheating, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the FET to be used in a variety of environments without risk of thermal damage, increasing its reliability.

Maximum Turn Off Time (toff): 65 ns

The fast turn-off time ensures quick and efficient switching transitions, reducing power loss and improving overall performance.

Reference Standard: TS 16949

Compliance with TS 16949 ensures that the FET meets quality and reliability standards, providing assurance of its performance and longevity.

Technical Specifications

Power Field Effect Transistors (FET) DN3525N8-G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Additional Features:

FAST SWITCHING

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (ID):

.36 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JEDEC-95 Code:

TO-243AA

JESD-30 Code:

R-PSSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1 A

Qualification:

Not Qualified

Reference Standard:

TS 16949

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

65 ns

Maximum Turn On Time (ton):

45 ns

Trade Compliance

DN3525N8-G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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