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ATSAMA5D43B-CUR

Microchip Technology

ATSAMA5D43B-CUR by Microchip Technology

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$12.602

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,000 parts In-Stock

1+ parts

$11.193

100+ parts

$10.638

1k+ parts

$10.570

10k+ parts

-

1,000

$11.193

$10.638

$10.570

-

Verical

USA . 1,000 parts In-Stock

1+ parts

$11.193

100+ parts

$10.638

1k+ parts

$10.570

10k+ parts

-

1,000

$11.193

$10.638

$10.570

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$14.010

100+ parts

$11.640

1k+ parts

$11.640

10k+ parts

-

1,000

$14.010

$11.640

$11.640

-

Microchip Technology

USA . 210 parts In-Stock

1+ parts

$14.010

100+ parts

$11.640

1k+ parts

$10.700

10k+ parts

$10.170

210

$14.010

$11.640

$10.700

$10.170

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 960 parts In-Stock

1+ parts

$12.130

100+ parts

-

1k+ parts

-

10k+ parts

-

960

$12.130

-

-

-

Component Stockers USA

USA . 36,537 parts In-Stock

1+ parts

$13.830

100+ parts

$11.490

1k+ parts

$10.560

10k+ parts

$15.360

36,537

$13.830

$11.490

$10.560

$15.360

iodParts Technologies Inc.

India . 8,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,016

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

West Coast Incorporated

USA . 2,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,084

-

-

-

-

Lixinc

USA . 974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

974

-

-

-

-

Technical Specifications

Microprocessors ATSAMA5D43B-CUR attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of Serial I/Os:

2

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

131072

Screening Level:

TS 16949

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ATSAMA5D43B-CUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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