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ATSAM4C8CB-AUR

Microchip Technology

ATSAM4C8CB-AUR by Microchip Technology

Microchip Technology's ATSAM4C8CB-AUR is a SoC with CMOS technology. It operates in industrial temperature range (-40 to 85 °C) and has a supply voltage range of 1.08V to 1.32V. With a compact square package style, it is ideal for applications requiring low profile and fine pitch designs.

Median Price

$8.010

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,500 parts In-Stock

1+ parts

$8.010

100+ parts

$6.660

1k+ parts

$6.120

10k+ parts

$5.820

1,500

$8.010

$6.660

$6.120

$5.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

-

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16

$10.290

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Maritex

Poland . 1,500 parts In-Stock

1+ parts

$10.766

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

$10.766

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-

-

VNN

France . 3,593 parts In-Stock

1+ parts

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3,593

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Vyrian

USA . 1,464 parts In-Stock

1+ parts

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1,464

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Digiode

USA . 992 parts In-Stock

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992

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 495 parts In-Stock

1+ parts

$5.040

100+ parts

-

1k+ parts

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495

$5.040

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Continental Prestige Electronics

USA . 4,609 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

-

10k+ parts

$10.084

4,609

$10.290

-

-

$10.084

Netroflash

USA . 100 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

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10k+ parts

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100

$10.290

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Ampacity Inc.

Singapore . 1,111 parts In-Stock

1+ parts

$13.000

100+ parts

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1,111

$13.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,807 parts In-Stock

1+ parts

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100+ parts

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9,807

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QualityLine Systems

Poland . 5,641 parts In-Stock

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5,641

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XL Components Corporation

Australia . 2,524 parts In-Stock

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2,524

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Marpe Global Electronics

Taiwan . 1,215 parts In-Stock

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1,215

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Argo Parts USA

USA . 1,164 parts In-Stock

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1,164

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Supply Digital

USA . 484 parts In-Stock

1+ parts

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484

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Corphita

USA . 262 parts In-Stock

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262

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Overview

Experience the cutting-edge technology of the ATSAM4C8CB-AUR by Microchip Technology, a leading manufacturer in the industry. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering endless possibilities for various applications. With its high-quality construction and advanced features, this device guarantees superior performance and reliability. Explore the world of innovation with Microchip Technology and unlock the potential of your projects with the ATSAM4C8CB-AUR. Discover the difference that top-notch technology can make in your work today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Easy and compact installation process, suitable for space-constrained applications.

Maximum Supply Voltage: 1.32 V

Allows for efficient power management while providing sufficient voltage for operation.

Package Shape: SQUARE

Optimal design for efficient use of space on a circuit board.

No. of Terminals: 100

Sufficient number of terminals for connecting various components, enhancing the versatility of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Streamlined design for improved thermal performance and signal integrity.

Minimum Supply Voltage: 1.08 V

Allows for low power consumption and efficient operation at lower voltages.

Maximum Operating Temperature: 85 °C

High temperature tolerance for reliable operation in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for versatility in various applications, including extreme conditions.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-term reliability and stable electrical connections.

Terminal Position: QUAD

Quad terminal layout for efficient signal routing and simplified circuit design.

Maximum Seated Height: 1.6 mm

Low profile design for space-saving installation and compatibility with compact electronic devices.

Width: 14 mm

Compact width for efficient placement on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 40

Optimal reflow process time for reliable soldering and assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for secure solder joints and durable connections.

Length: 14 mm

Compact length for space-efficient placement on a circuit board.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with high temperature and environmental requirements.

Peripheral IC Type: SoC

Integrated System on Chip design for streamlined functionality and efficient performance.

Technology: CMOS

CMOS technology for low power consumption and reliable operation in various applications.

Terminal Form: GULL WING

Gull wing terminal design for secure mounting and reliable electrical connections.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for efficient power management and stable operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for reliable performance in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATSAM4C8CB-AUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

ATSAM4C8CB-AUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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