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ATA663254-GBQW-V07

Microchip Technology

ATA663254-GBQW-V07 by Microchip Technology

ATA663254-GBQW-V07 by Microchip: LIN transceiver for automotive apps. Operates at -40 to 150°C, with 13.5V supply voltage. Small outline package, no lead terminals, AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 2,725 parts In-Stock

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2,725

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Vyrian

USA . 131 parts In-Stock

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131

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,632 parts In-Stock

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$11.420

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$11.420

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Corohmni

South Africa . 1,093 parts In-Stock

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$11.561

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1,093

$11.561

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AZTECH Wire

Italy . 721 parts In-Stock

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$14.223

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721

$14.223

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Semicontronic

India . 670 parts In-Stock

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$599.000

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$584.025

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$581.030

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670

$599.000

$584.025

$581.030

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Ampacity Inc.

Singapore . 1,019 parts In-Stock

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$842.000

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1,019

$842.000

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RGB Technical Solutions

Ukraine . 6,894 parts In-Stock

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Argo Parts USA

USA . 4,072 parts In-Stock

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Continental Prestige Electronics

USA . 765 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your automotive networking capabilities with the ATA663254-GBQW-V07 by Microchip Technology. This cutting-edge LIN transceiver boasts top-notch quality and reliability, thanks to Microchip's renowned expertise in the field. Ideal for a wide range of network interface applications, this product offers unparalleled value with its small outline package, high-temperature grade, and low supply current. Trust Microchip Technology to deliver innovative solutions that exceed expectations, ensuring seamless connectivity and optimal performance for your automotive needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials are durable and lightweight, making the product sturdy and easy to handle.

Surface Mount: YES

Being surface mountable makes the product easy to install on circuit boards, saving space and simplifying the assembly process.

Screening Level: AEC-Q100; TS 16949

Compliance with AEC-Q100 and TS 16949 standards ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

The square shape allows for efficient placement and utilization of space on the circuit board.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the device to other components in the system.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the product to be used in various environments.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connection options, improving the overall reliability of the product.

Maximum Seated Height: 0.9 mm

The low seated height makes the product suitable for compact designs and reduces the overall profile of the system.

Width: 3 mm

The compact width of 3mm enables the product to fit in tight spaces and densely packed circuit boards.

Length: 3 mm

Having a length of 3mm contributes to the overall compactness and efficiency of the product.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product is built to withstand the demanding conditions of automotive environments.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and compliant with current regulations.

Maximum Supply Current: 0.95 mA

The low supply current requirement helps in reducing power consumption and heat dissipation in the system.

Telecom IC Type: LIN TRANSCEIVER

The LIN transceiver enables communication in automotive networks, making the product suitable for automotive electronics.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5V is suitable for automotive applications, providing stable power to the device.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high density mounting on circuit boards, saving space and improving efficiency.

Technical Specifications

Network Interfaces ATA663254-GBQW-V07 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.9 mm

Maximum Supply Current:

.95 mA

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

ATA663254-GBQW-V07 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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