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ATA663254-FAQW

Microchip Technology

ATA663254-FAQW by Microchip Technology

ATA663254-FAQW by Microchip Tech is a small outline, heat sink package with 8 terminals. It's a network interface IC with 0.65mm terminal pitch and 13.5V nominal voltage. Ideal for telecom applications due to its low profile and dual terminal position.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 14,100 parts In-Stock

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Vyrian

USA . 922 parts In-Stock

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VNN

France . 817 parts In-Stock

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Digiode

USA . 758 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 282 parts In-Stock

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$11.998

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Ampacity Inc.

Singapore . 148 parts In-Stock

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$860.000

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,959 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,306 parts In-Stock

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Fulton Briggs Corp.

USA . 3,209 parts In-Stock

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Supply Digital

USA . 1,090 parts In-Stock

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Corphita

USA . 513 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Enhance your network interfaces with the ATA663254-FAQW by Microchip Technology. Trusted for its superior quality and reliability, this product is perfect for a variety of applications. With its small outline and very thin profile, this interface circuit offers easy installation and efficient performance. Say goodbye to connectivity issues and enjoy seamless communication with this innovative solution. Upgrade your networking systems today with the ATA663254-FAQW and experience the benefits firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the network interface easy to handle and resistant to damage during installation and use.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape helps in efficient placement and alignment on a circuit board for optimal performance and connectivity.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and interfaces, increasing the versatility and compatibility of the network interface.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile of the package style ensure space-saving design, while the heat sink/slug feature helps in dissipating heat efficiently for better performance and reliability.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connections, ensuring stable and secure connections for data transmission.

Maximum Seated Height: 0.9 mm

Low seated height allows for a compact design, making it suitable for applications where space is limited.

Width: 3 mm

Narrow width enables easy integration and placement within a circuit board, optimizing the layout for efficient performance.

Length: 3 mm

Compact length ensures minimal footprint on the circuit board, saving space and allowing for a neat and organized layout.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of short circuits and is environmentally friendly, meeting modern safety and sustainability standards.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for telecom applications, the interface circuit ensures seamless communication and compatibility with various network devices and systems.

Nominal Supply Voltage: 13.5 V

Optimal supply voltage of 13.5 V ensures stable and efficient operation, meeting the power requirements of the network interface for reliable performance.

Terminal Pitch: 0.65 mm

Small terminal pitch of 0.65 mm allows for dense packing and precise connections, enhancing signal integrity and reducing interference for smooth data transmission.

Technical Specifications

Network Interfaces ATA663254-FAQW attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ATA663254-FAQW Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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