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ATA6563-GBQW1-VAO

Microchip Technology

ATA6563-GBQW1-VAO by Microchip Technology

ATA6563-GBQW1-VAO by Microchip is a CAN FD transceiver with 8 terminals, AEC-Q100 screening, and 5V supply voltage. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,457 parts In-Stock

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VNN

France . 1,361 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Corohmni

South Africa . 368 parts In-Stock

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$6.734

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368

$6.734

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Aztec Data Supply Inc.

USA . 364 parts In-Stock

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$9.950

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364

$9.950

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AZTECH Wire

Italy . 308 parts In-Stock

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$10.961

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Semicontronic

India . 1,505 parts In-Stock

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$234.000

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$228.150

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$226.980

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$234.000

$228.150

$226.980

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Ampacity Inc.

Singapore . 492 parts In-Stock

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$284.000

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492

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QUARKTWIN TECHNOLOGY LTD

USA . 20,809 parts In-Stock

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Continental Prestige Electronics

USA . 5,555 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,181 parts In-Stock

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Argo Parts USA

USA . 4,733 parts In-Stock

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LMD Electronica

Estonia . 3,490 parts In-Stock

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Montano Global Distributors

Canada . 2,632 parts In-Stock

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Ledger Components

France . 2,606 parts In-Stock

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NIA Electronics

USA . 1,328 parts In-Stock

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Microchip USA

USA . 1,300 parts In-Stock

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1,300

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Advanced Electronics

New Zealand . 261 parts In-Stock

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261

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Enhance your network interfaces with the ATA6563-GBQW1-VAO by Microchip Technology. Designed with quality and reliability in mind, this product offers cutting-edge technology for a wide range of applications. With its AEC-Q100 and AEC-Q006 screening levels, this CAN FD transceiver ensures top-notch performance even in the harshest environments. Trust Microchip Technology to deliver innovative solutions that provide value, efficiency, and peace of mind to our customers. Elevate your network capabilities today with the ATA6563-GBQW1-VAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Screening Level: AEC-Q100;AEC-Q006

Compliance with AEC-Q100 and AEC-Q006 standards ensures high reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

Square shape provides stability and ease of mounting, ensuring proper alignment on the circuit board.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, enabling versatile usage and connectivity options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact size with heat sink and thin profile design allows for efficient heat dissipation and space-saving in crowded electronic setups.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in extreme conditions, making it reliable for various applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in cold environments without impacting the functionality of the product.

Terminal Position: DUAL

Dual terminal position offers flexibility in wiring configurations and ensures secure connections for reliable performance.

Maximum Seated Height: 0.9 mm

Low maximum seated height enables compact and space-efficient design, ideal for applications with limited vertical clearance.

Width: 3 mm

Narrow width facilitates easy integration into tight spaces, making it suitable for compact electronic devices.

Length: 3 mm

Short length allows for efficient use of board space, enabling dense packing of components for optimized circuit layout.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of solder joint cracking and improves long-term reliability of the product.

Maximum Supply Current: 85 mA

High maximum supply current capability ensures stable operation and ample power for continuous and reliable performance.

Telecom IC Type: CAN FD TRANSCEIVER

Specialized CAN FD transceiver telecom IC type enables high-speed communication and compatibility with CAN bus networks, making it suitable for automotive and industrial applications.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent power delivery for reliable and efficient operation of the product.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for compact layout on circuit boards, saving space and enabling efficient signal routing for optimized performance.

Technical Specifications

Network Interfaces ATA6563-GBQW1-VAO attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100;AEC-Q006

Maximum Seated Height:

.9 mm

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

ATA6563-GBQW1-VAO Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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