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ATA6566-GBQW1-VAO

Microchip Technology

ATA6566-GBQW1-VAO by Microchip Technology

ATA6566-GBQW1-VAO by Microchip is a CAN FD transceiver with AEC-Q100 screening. It operates at -40 to 125 °C, drawing 85 mA at 5 V. With a small outline package and dual terminals, it's ideal for automotive network interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 26,494 parts In-Stock

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Vyrian

USA . 2,573 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$17.867

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215

$17.867

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Ampacity Inc.

Singapore . 459 parts In-Stock

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$208.000

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459

$208.000

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Argo Parts USA

USA . 4,445 parts In-Stock

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Montano Global Distributors

Canada . 4,218 parts In-Stock

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Ledger Components

France . 3,503 parts In-Stock

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Continental Prestige Electronics

USA . 3,242 parts In-Stock

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LMD Electronica

Estonia . 2,845 parts In-Stock

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NIA Electronics

USA . 2,606 parts In-Stock

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Vigor

Singapore . 1,930 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,432 parts In-Stock

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Microchip USA

USA . 1,378 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Get ready to experience unparalleled connectivity with the ATA6566-GBQW1-VAO by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-quality products that are reliable and efficient. The ATA6566-GBQW1-VAO is a must-have in network interfaces, offering seamless integration and performance. Whether you're looking to enhance your automotive systems or industrial applications, this product provides unmatched value and benefits. Trust Microchip Technology for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability and performance in harsh operating conditions.

Package Shape: SQUARE

Allows for a compact design, optimizing space efficiency in the overall system layout.

No. of Terminals: 8

Provides sufficient connectivity options for the device to interface with other components or systems.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, ensuring continued operation without overheating.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of environments and applications.

Terminal Position: DUAL

Allows for flexibility in mounting and connection options, enhancing versatility in system integration.

Maximum Seated Height: 0.9 mm

Low profile design enables compact and sleek product designs.

Width: 3 mm

Small form factor facilitates space-saving installations in tight spaces or crowded environments.

Length: 3 mm

Compact size allows for easy integration into various electronic devices or systems.

Terminal Form: NO LEAD

Lead-free design complies with environmental regulations and minimizes potential health risks.

Maximum Supply Current: 85 mA

Operates efficiently with low power consumption, reducing energy costs.

Telecom IC Type: CAN FD TRANSCEIVER

Specifically designed for communication in automotive and industrial applications, ensuring reliable data transmission.

Nominal Supply Voltage: 5 V

Compatible with standard voltage levels, making it easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

Provides fine connectivity options for high-density circuit boards, optimizing signal transmission.

Technical Specifications

Network Interfaces ATA6566-GBQW1-VAO attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

ATA6566-GBQW1-VAO Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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