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ATA6566-GAQW1-VAO

Microchip Technology

ATA6566-GAQW1-VAO by Microchip Technology

ATA6566-GAQW1-VAO by Microchip: AEC-Q100 compliant CAN FD transceiver. Operates at -40 to 125°C with 5V supply voltage. Small outline package, gull wing terminals for automotive network interfaces.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,644 parts In-Stock

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VNN

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Nova Conductors

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AZTECH Wire

Italy . 751 parts In-Stock

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Ampacity Inc.

Singapore . 806 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,339 parts In-Stock

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NIA Electronics

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Ledger Components

France . 7,997 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

USA . 4,561 parts In-Stock

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Vigor

Singapore . 2,995 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,027 parts In-Stock

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LMD Electronica

Estonia . 764 parts In-Stock

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Montano Global Distributors

Canada . 619 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Argo Parts USA

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Overview

Upgrade your network interfaces with the ATA6566-GAQW1-VAO by industry leader Microchip Technology. Designed for high performance and reliability, this CAN FD transceiver offers seamless communication in a compact package. With AEC-Q100 screening and a wide operating temperature range, this product ensures durability in any environment. Experience improved connectivity and efficiency with the ATA6566-GAQW1-VAO, a must-have for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and light weight, making the product suitable for various applications.

Surface Mount: Yes

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and performance in automotive applications, making it a reliable choice for automotive networking needs.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and allows for easy integration into existing PCB designs.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for a variety of networking configurations and requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs or applications with limited space.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can reliably function in harsh environments or conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in various climates or environments where temperatures can drop significantly.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connecting the device, offering multiple options for integration into the network system.

Maximum Seated Height: 1.75 mm

The low seated height profile enables a compact design, making it suitable for applications where space is limited.

Width: 3.9 mm

Compact width dimension allows for efficient use of PCB space and enables a sleek and streamlined design.

Length: 4.9 mm

The moderate length provides a good balance between compactness and functionality, making it versatile for various applications.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and easy solderability, ensuring reliable connectivity and robustness in operation.

Maximum Supply Current: 85 mA

With a maximum supply current of 85 mA, the product is energy-efficient and can operate within specified power limits for optimal performance.

Telecom IC Type: CAN FD TRANSCEIVER

Being a CAN FD transceiver type specifically designed for telecom applications, this product ensures reliable and high-speed data transmission in networking systems.

Nominal Supply Voltage: 5 V

Operating at a standard nominal supply voltage of 5V, this product is compatible with most systems and offers stable performance.

Terminal Pitch: 1.27 mm

The fine terminal pitch of 1.27 mm enables high-density mounting on the PCB, maximizing connectivity options and allowing for intricate network configurations.

Technical Specifications

Network Interfaces ATA6566-GAQW1-VAO attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

ATA6566-GAQW1-VAO Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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