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AT93C46E-TH-B

Microchip Technology

AT93C46E-TH-B by Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,065 parts In-Stock

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$0.080

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Arrow

USA . 1,068 parts In-Stock

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$0.146

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Microchip Technology

USA . 29,500 parts In-Stock

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$0.230

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DigiKey

USA . 890 parts In-Stock

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$0.280

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Mouser Electronics

USA . 575 parts In-Stock

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Adafruit Industries

USA . 500 parts In-Stock

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$6.363

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$5.790

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$5.218

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500

$6.363

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Verical

USA . 1,900 parts In-Stock

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$0.400

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1,900

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Master Electronics

USA . 1,900 parts In-Stock

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$0.466

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$0.311

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$0.291

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$0.291

Chip1Stop

Japan . 2 parts In-Stock

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Digiode

USA . 281 parts In-Stock

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$0.169

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Vyrian

USA . 932 parts In-Stock

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$0.178

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NAC Semi

USA . 23,500 parts In-Stock

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$0.310

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$0.280

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$0.250

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$0.310

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IBS Electronics

USA . 6,862 parts In-Stock

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$0.204

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$0.195

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$0.341

6,862

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R&J Components

USA . 4,400 parts In-Stock

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Electro Sonic

Canada . 2,000 parts In-Stock

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$0.297

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$0.275

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$0.251

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ACDS - Activité Composants Distribution Service

France . 1,440 parts In-Stock

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Prism Electronics

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Chip Stock

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Bristol Electronics

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Semi Source

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Inventory MP

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TME

Poland . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 565 parts In-Stock

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$0.160

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Vigor

Singapore . 1,722 parts In-Stock

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Ampacity Inc.

Singapore . 6,850 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$6.363

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$5.790

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$5.218

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$6.363

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Lixinc

USA . 13,818 parts In-Stock

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Perfect Parts

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Marpe Global Electronics

Taiwan . 5,236 parts In-Stock

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QualityLine Systems

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Cyclops Electronics Ltd (Excess)

UK . 1,440 parts In-Stock

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Supply Digital

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XL Components Corporation

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EMSNET (Excess)

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Technical Specifications

EEPROM AT93C46E-TH-B attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

5

Qualification:

Not Qualified

Reverse Pinout:

NO

Maximum Seated Height:

1.2 mm

Serial Bus Type:

3-WIRE

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

AT93C46E-TH-B Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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