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APA1000-PQG208A

Microchip Technology

APA1000-PQG208A by Microchip Technology

APA1000-PQG208A by Microchip is a CMOS FPGA with 56320 logic cells, 158 inputs/outputs, and 208 terminals. It uses 2.5V power supplies, has a peak reflow temp of 245°C, and MSL level of 3. Ideal for applications requiring high-density programmable ICs in a square package with Gull Wing terminals.

Median Price

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Lifecycle Status

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4

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1k+

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VNN

France . 5,213 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Vyrian

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512

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Digiode

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AZTECH Wire

Italy . 512 parts In-Stock

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$10.473

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Semicontronic

India . 1,517 parts In-Stock

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$25.350

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$25.220

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Component Stockers USA

USA . 516 parts In-Stock

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$99.990

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Vigor

Singapore . 8,518 parts In-Stock

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Microchip USA

USA . 1,222 parts In-Stock

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Fulton Briggs Corp.

USA . 7,450 parts In-Stock

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Continental Prestige Electronics

USA . 5,267 parts In-Stock

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Argo Parts USA

USA . 3,695 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Corphita

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Overview

Unlock innovation and unleash the power of your designs with the APA1000-PQG208A by Microchip Technology. As a leader in the field, Microchip delivers top-quality Field Programmable Gate Arrays that offer unparalleled flexibility and customization. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, this FPGA is the perfect solution for your unique needs. Experience seamless integration, reliable performance, and endless possibilities with the APA1000-PQG208A. Elevate your projects to new heights with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, ensuring long-lasting performance in various environments.

No. of Logic Cells: 56320

Large number of logic cells allow for complex programmability and versatile functionality in applications.

Surface Mount: YES

Surface mount technology enables easy installation and integration into circuit boards, saving time and effort during assembly.

Technology Used: CMOS

CMOS technology offers low power consumption and high speed operation, making the FPGA efficient and reliable for different tasks.

No. of Inputs: 158

Abundance of inputs allow for extensive connectivity and input options, enhancing the versatility of the FPGA for diverse applications.

Package Shape: SQUARE

Square package shape provides efficient use of space on circuit boards, making it easier to fit the FPGA into various designs and layouts.

Form Of Terminal: GULL WING

Gull wing terminals facilitate secure and stable connections, ensuring reliable performance and connectivity in the FPGA.

Packing Method: TRAY

Tray packing method offers organized and protective storage for the FPGA, simplifying handling and logistics for manufacturers and distributors.

Power Supplies (V): 2.5,2.5/3.3

Multiple power supply options provide flexibility and compatibility with different voltage requirements, enhancing the FPGA's adaptability in various systems.

No. of Terminals: 208

Ample terminals enable extensive connectivity and signal routing capabilities, allowing the FPGA to interface with a wide range of components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this IC type offers reprogrammability and customization options, making it suitable for a range of applications that require flexibility and adaptability.

Package Style (Meter): FLATPACK

Flatpack package style is compact and space-efficient, optimizing the footprint of the FPGA on circuit boards and enabling efficient layout designs.

Pitch Of Terminal: 0.5 mm

Small pitch size of terminals allows for high-density packaging and connections, enabling efficient signal routing and compact board layouts in the FPGA.

Position Of Terminal: QUAD

Quad position of terminals provides stability and reliability in connections, ensuring secure and consistent performance in the FPGA's interactions with external components.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the FPGA has moderate moisture resistance, suitable for use in controlled indoor environments with standard humidity levels.

No. of Outputs: 158

Numerous outputs offer multiple signaling options and connectivity possibilities, enhancing the versatility and functionality of the FPGA in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time of 30 seconds ensures efficient and reliable soldering processes during assembly, minimizing the risk of thermal damage to the FPGA.

Peak Reflow Temperature °C: 245

High peak reflow temperature of 245°C allows for secure and robust soldering joints, guaranteeing the mechanical integrity and performance of the FPGA in demanding operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) APA1000-PQG208A attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

56320

No. of Inputs:

158

No. of Outputs:

158

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack

Package Code:

QFP

Package Shape:

Packing Method:

Tray

Package Equivalence Code:

QFP208,1.2SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

Qualified:

No

Trade Compliance

APA1000-PQG208A Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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