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AFS600-FGG256K

Microchip Technology

AFS600-FGG256K by Microchip Technology

Microchip Technology's AFS600-FGG256K is a CMOS FPGA with 600,000 gates. It operates b/w -55 to 100°C and has a supply voltage range of 1.425V to 1.575V. This low-profile GRID ARRAY package is ideal for high-performance applications requiring advanced programmable logic solutions.

Median Price

$578.554

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Arrow

USA . 6 parts In-Stock

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$575.867

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Microchip Technology

USA . 40 parts In-Stock

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$581.240

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$573.270

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$307.720

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40

$581.240

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$307.720

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Distributors (In-Stock)

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Digiode

USA . 343 parts In-Stock

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$547.074

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Nova Conductors

Japan . 100 parts In-Stock

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$581.242

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VNN

France . 1,410 parts In-Stock

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Vyrian

USA . 839 parts In-Stock

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Chip Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 839 parts In-Stock

1+ parts

$6.770

100+ parts

$6.500

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$6.370

10k+ parts

$6.240

839

$6.770

$6.500

$6.370

$6.240

Ampacity Inc.

Singapore . 20 parts In-Stock

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$489.490

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Semicontronic

India . 20 parts In-Stock

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$489.490

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$477.253

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$474.805

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Corphita

USA . 352 parts In-Stock

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$518.280

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Aranea Global

USA . 2,000 parts In-Stock

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$569.617

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$546.833

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Continental Prestige Electronics

USA . 2,787 parts In-Stock

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$581.242

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Argo Parts USA

USA . 894 parts In-Stock

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$581.242

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$575.430

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$569.617

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$563.805

894

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$575.430

$569.617

$563.805

Microchip USA

USA . 4,043 parts In-Stock

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$581.742

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Fulton Briggs Corp.

USA . 1,890 parts In-Stock

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Overview

Unlock endless possibilities with the AFS600-FGG256K by Microchip Technology. As a leader in FPGA technology, Microchip ensures top-notch quality and reliability in every product. This versatile FPGA is perfect for a wide range of applications, from industrial automation to telecommunications. Experience the value and benefits of this innovative Field Programmable Gate Array, offering 600,000 equivalent gates and a low profile grid array package style. Trust Microchip to deliver cutting-edge solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA, ensuring reliable performance even in challenging environments.

Maximum Supply Voltage: 1.575 V

Allows for efficient power consumption and operation at a higher voltage level, providing flexibility in usage scenarios.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making the FPGA energy-efficient and fast.

No. of Equivalent Gates: 600000

Provides a high level of functionality and processing power, making the FPGA suitable for complex applications that require extensive logic operations.

Minimum Operating Temperature: -55 °C

Ensures reliable operation even in extreme cold environments, making the FPGA versatile and adaptable for a wide range of applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AFS600-FGG256K attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Equivalent Gates:

600000

Technology:

CMOS

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

AFS600-FGG256K Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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