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AFS600-FGG256I

Microchip Technology

AFS600-FGG256I by Microchip Technology

Microchip Technology's AFS600-FGG256I is a CMOS FPGA with 600,000 gates. Operating at 1.5V, it has a max supply voltage of 1.575V and min of 1.425V. Ideal for industrial applications requiring high gate count and low profile grid array packaging.

Median Price

$290.630

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Mouser Electronics

USA . 178 parts In-Stock

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$290.630

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DigiKey

USA . 30 parts In-Stock

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$290.630

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Verical

USA . 1 parts In-Stock

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Digiode

USA . 277 parts In-Stock

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$276.098

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Nova Conductors

Japan . 23 parts In-Stock

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VNN

France . 6,878 parts In-Stock

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Chip Stock

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Vyrian

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IBS Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 546 parts In-Stock

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$17.750

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$17.050

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$16.710

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$16.370

546

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$16.370

Corohmni

South Africa . 75 parts In-Stock

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Semicontronic

India . 171 parts In-Stock

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$247.030

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$240.854

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$239.619

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Corphita

USA . 474 parts In-Stock

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$261.567

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Component Stockers USA

USA . 420 parts In-Stock

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$283.070

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Continental Prestige Electronics

USA . 2,976 parts In-Stock

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$303.388

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$297.320

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Netroflash

USA . 2,000 parts In-Stock

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Microchip USA

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Ledger Components

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LMD Electronica

Estonia . 7,637 parts In-Stock

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NIA Electronics

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Montano Global Distributors

Canada . 5,089 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 2,098 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,358 parts In-Stock

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Overview

Unlock endless possibilities with the AFS600-FGG256I by Microchip Technology. This cutting-edge Field Programmable Gate Array is crafted from high-quality materials and advanced CMOS technology, ensuring top-notch performance. Whether you're in automotive, aerospace, or telecommunications industries, this FPGA offers unparalleled flexibility and reliability. Say goodbye to limitations and hello to innovation with the AFS600-FGG256I. Elevate your projects and exceed expectations with this game-changing product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and thermal resistance, making the FPGA suitable for a wide range of applications.

Maximum Supply Voltage: 1.575 V

With a maximum supply voltage of 1.575 V, the FPGA offers efficient power consumption and support for low voltage applications.

Technology Used: CMOS

CMOS technology ensures low power consumption and high speed operation, enhancing the overall performance of the FPGA.

No. of Equivalent Gates: 600000

With 600,000 equivalent gates, this FPGA provides ample logic resources for complex designs and applications.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage of 1.5 V ensures stable operation and compatibility with standard power sources.

No. of Terminals: 256

The 256 terminals offer ample connectivity options for interfacing the FPGA with other components or systems.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C to 85°C makes this FPGA suitable for industrial and harsh environments.

Length: 17 mm

Compact dimensions of 17 mm x 17 mm save space on the PCB and allow for integration into small form factor devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AFS600-FGG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Equivalent Gates:

600000

Technology:

CMOS

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

AFS600-FGG256I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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