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A3P1000-FGG256M

Microchip Technology

A3P1000-FGG256M by Microchip Technology

A3P1000-FGG256M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. It operates b/w -55 to 125 °C, has 177 inputs/outputs, and uses a low profile grid array package. Ideal for applications requiring high gate count and programmable IC flexibility.

Median Price

$252.190

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

USA . 6,220 parts In-Stock

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VNN

France . 4,292 parts In-Stock

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Chip Stock

USA . 757 parts In-Stock

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Digiode

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Distributors (Availability)

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AZTECH Wire

Italy . 440 parts In-Stock

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$14.227

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Ampacity Inc.

Singapore . 993 parts In-Stock

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$25.000

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Semicontronic

India . 1,046 parts In-Stock

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$34.000

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$33.150

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$32.980

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Corohmni

South Africa . 195 parts In-Stock

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$54.851

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Advanced Electronics

New Zealand . 646 parts In-Stock

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$113.861

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$108.168

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Aztec Data Supply Inc.

USA . 4,622 parts In-Stock

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$129.364

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Continental Prestige Electronics

USA . 5,049 parts In-Stock

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Vigor

Singapore . 56,460 parts In-Stock

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LOOK Integrated Logistics

Peru . 8,101 parts In-Stock

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Ledger Components

France . 7,210 parts In-Stock

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LMD Electronica

Estonia . 4,630 parts In-Stock

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NIA Electronics

USA . 4,334 parts In-Stock

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Montano Global Distributors

Canada . 3,920 parts In-Stock

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Argo Parts USA

USA . 3,048 parts In-Stock

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Bastille Electronics

Australia . 2,761 parts In-Stock

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Corphita

USA . 305 parts In-Stock

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Overview

Elevate your projects to new heights with the A3P1000-FGG256M by Microchip Technology, a top-tier manufacturer known for cutting-edge technology and reliable products. This Field Programmable Gate Array (FPGA) boasts 1000000 equivalent gates and 177 inputs/outputs, making it ideal for a wide range of applications. With a nominal supply voltage of 1.5 V and a maximum operating temperature of 125 °C, this FPGA delivers unmatched performance in a compact package. Experience the value and benefits of advanced CMOS technology, precise engineering, and superior quality with the A3P1000-FGG256M.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FPGA.

No. of Logic Cells: 24576

With a high number of logic cells, this FPGA can handle complex logic operations effectively.

Maximum Supply Voltage: 1.575 V

Operating within this voltage range ensures stability and reliability for the FPGA.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

No. of Inputs: 177

Having a high number of inputs allows for versatile connectivity and input options for the FPGA.

Package Shape: SQUARE

Square packages are space-efficient and easy to mount on circuit boards.

No. of Equivalent Gates: 1000000

With a large number of equivalent gates, this FPGA can handle complex logic functions and tasks efficiently.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage of 1.5 V offers a balance between performance and power efficiency.

No. of Terminals: 256

With a high number of terminals, this FPGA can support multiple connections and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile design make this FPGA suitable for space-constrained applications.

Minimum Supply Voltage: 1.425 V

Having a low minimum supply voltage allows for flexibility in power supply options.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliability in various environmental conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for denser packing and efficient use of space on circuit boards.

Organization: 1000000 GATES

With a well-organized structure and 1 million gates, this FPGA can handle complex logic operations efficiently.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for operation in harsh and cold environments.

Position Of Terminal: BOTTOM

The terminal position at the bottom makes it easier for PCB designers to route connections effectively.

Maximum Seated Height: 1.7 mm

The low seated height allows for a compact and space-efficient design when mounted on PCBs.

Width: 17 mm

The compact width makes this FPGA suitable for applications where space is limited.

No. of Outputs: 177

Having a high number of outputs allows for versatile output options and connectivity for the FPGA.

Length: 17 mm

The short length of the FPGA contributes to a compact and space-efficient overall design on PCBs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A3P1000-FGG256M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

24576

No. of Inputs:

177

No. of Outputs:

177

No. of Equivalent Gates:

1000000

Technology:

CMOS

Organization:

1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Trade Compliance

A3P1000-FGG256M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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