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25AA512T-I/SN16KVAO

Microchip Technology

25AA512T-I/SN16KVAO by Microchip Technology

Microchip Technology's 25AA512T-I/SN16KVAO is a serial EEPROM with 64KX8 organization, operating at 5V. It offers a max clock frequency of 20 MHz and endurance of 1M write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,873 parts In-Stock

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7,873

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VNN

France . 978 parts In-Stock

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978

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Distributors (Availability)

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Corohmni

South Africa . 368 parts In-Stock

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$2.786

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368

$2.786

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$3.283

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$3.118

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$3.118

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$3.283

$3.118

$3.118

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Aztec Data Supply Inc.

USA . 2,807 parts In-Stock

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$4.250

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$4.250

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AZTECH Wire

Italy . 795 parts In-Stock

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$14.242

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795

$14.242

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Semicontronic

India . 842 parts In-Stock

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$19.000

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$18.525

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$18.430

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842

$19.000

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$18.430

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Ampacity Inc.

Singapore . 149 parts In-Stock

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$28.000

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149

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Montano Global Distributors

Canada . 8,372 parts In-Stock

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NIA Electronics

USA . 8,027 parts In-Stock

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LMD Electronica

Estonia . 6,575 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,380 parts In-Stock

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Continental Prestige Electronics

USA . 4,337 parts In-Stock

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Ledger Components

France . 2,553 parts In-Stock

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Microchip USA

USA . 1,778 parts In-Stock

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Argo Parts USA

USA . 727 parts In-Stock

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727

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Bastille Electronics

Australia . 63 parts In-Stock

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63

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Overview

Unlock endless possibilities with the 25AA512T-I/SN16KVAO by Microchip Technology. Crafted with precision and expertise, this EEPROM boasts unparalleled quality and reliability. Perfect for a wide range of applications, this product offers customers enhanced value and performance. Experience seamless operation and maximum efficiency with this cutting-edge technology. Elevate your projects with the innovative features and advantages that only Microchip Technology can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring longevity and ease of handling.

Surface Mount: YES

Easy and efficient installation on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and control, enhancing performance in data transfer.

Nominal Supply Voltage (Vsup): 5V

Compatible with standard voltage levels, making it easy to integrate into existing systems.

Organization: 64KX8

Organized as 64 kilobits of memory divided into 8-bit words, providing ample storage capacity and efficient data retrieval.

Write Protection: HARDWARE/SOFTWARE

Allows for flexible write protection options, ensuring data security and integrity.

Maximum Clock Frequency (fCLK): 20 MHz

High clock frequency for fast data transfer and operations, improving overall system performance.

Memory Density: 524288 bit

High memory density for storing a large amount of data in a compact package, suitable for a wide range of applications.

Endurance: 1000000 Write/Erase Cycles

High endurance for frequent read/write operations, ensuring long-term reliability and durability.

Technical Specifications

EEPROM 25AA512T-I/SN16KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

2.5V TO 5.5V @ 0.1MHz

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

5

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25AA512T-I/SN16KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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