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24AA1026T-I/SN

Microchip Technology

24AA1026T-I/SN by Microchip Technology

24AA1026T-I/SN by Microchip Technology is an EEPROM with 128KX8 organization, operating at 2.5V and featuring I2C control byte 1010DDMR. It has a max clock frequency of 0.4 MHz and can endure up to 1,000,000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$4.050

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,510 parts In-Stock

1+ parts

$4.050

100+ parts

$4.010

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2,510

$4.050

$4.010

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

$4.645

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-

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40

$4.645

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Chip Stock

USA . 8,152 parts In-Stock

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8,152

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Vyrian

USA . 5,687 parts In-Stock

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5,687

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VNN

France . 970 parts In-Stock

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970

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,001 parts In-Stock

1+ parts

$3.240

100+ parts

$3.159

1k+ parts

$3.143

10k+ parts

-

3,001

$3.240

$3.159

$3.143

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Corohmni

South Africa . 270 parts In-Stock

1+ parts

$3.790

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270

$3.790

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Continental Prestige Electronics

USA . 5,314 parts In-Stock

1+ parts

$4.645

100+ parts

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10k+ parts

$4.552

5,314

$4.645

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$4.552

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.645

100+ parts

$4.552

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-

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1,000

$4.645

$4.552

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Aztec Data Supply Inc.

USA . 50 parts In-Stock

1+ parts

$4.760

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50

$4.760

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Lixinc

USA . 13,334 parts In-Stock

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13,334

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Fulton Briggs Corp.

USA . 1,526 parts In-Stock

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1,526

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Infinite Electronics LLP (Excess)

. 1,280 parts In-Stock

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1,280

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Argo Parts USA

USA . 111 parts In-Stock

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111

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Overview

Unlock the power of reliable data storage with the 24AA1026T-I/SN EEPROM by Microchip Technology. Designed for industrial-grade applications, this high-quality memory IC offers a durable solution for a wide range of projects. With a million write/erase cycles and a small outline package style, this EEPROM is perfect for devices where space is limited. Trust in Microchip's expertise and enhance your products with the superior performance and endurance of the 24AA1026T-I/SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the EEPROM, making it suitable for various environments.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V allows for low power consumption, making it energy-efficient and cost-effective.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures efficient data transfer and communication within the EEPROM, enhancing performance and speed.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options and flexibility for integrating the EEPROM into different electronic systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this EEPROM is suitable for industrial applications where temperature variations are common.

Memory Density: 1048576 bit

The high memory density of 1048576 bits allows for storing a large amount of data in the EEPROM, making it ideal for applications that require extensive storage capabilities.

Technical Specifications

EEPROM 24AA1026T-I/SN attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA1026T-I/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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