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23A640-I/ST

Microchip Technology

23A640-I/ST by Microchip Technology

Microchip Technology's 23A640-I/ST is an 8Kx8 SRAM with a max clock frequency of 16MHz. Operating at 1.8V, it features separate I/O and offers a memory density of 65536 bits. Ideal for industrial applications requiring high-speed synchronous memory in a small outline package.

Median Price

$0.860

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 335 parts In-Stock

1+ parts

$0.860

100+ parts

$0.788

1k+ parts

-

10k+ parts

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335

$0.860

$0.788

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.817

100+ parts

-

1k+ parts

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50

$0.817

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Vyrian

USA . 3,643 parts In-Stock

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3,643

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VNN

France . 1,634 parts In-Stock

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1,634

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,430 parts In-Stock

1+ parts

$0.680

100+ parts

-

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10k+ parts

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3,430

$0.680

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Argo Parts USA

USA . 2,992 parts In-Stock

1+ parts

$0.817

100+ parts

-

1k+ parts

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10k+ parts

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2,992

$0.817

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Continental Prestige Electronics

USA . 2,324 parts In-Stock

1+ parts

$0.817

100+ parts

-

1k+ parts

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10k+ parts

$0.800

2,324

$0.817

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-

$0.800

AZTECH Wire

Italy . 505 parts In-Stock

1+ parts

$11.955

100+ parts

-

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505

$11.955

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NIA Electronics

USA . 5,321 parts In-Stock

1+ parts

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5,321

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Montano Global Distributors

Canada . 5,186 parts In-Stock

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5,186

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Ledger Components

France . 1,563 parts In-Stock

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1,563

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LMD Electronica

Estonia . 515 parts In-Stock

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515

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LOOK Integrated Logistics

Peru . 160 parts In-Stock

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160

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Overview

Unlock endless possibilities with the 23A640-I/ST by Microchip Technology, a top-tier manufacturer in the industry. This high-quality SRAM offers unrivaled performance and reliability, making it perfect for a wide range of applications. From IoT devices to industrial equipment, this product provides seamless operation with its synchronous mode and separate I/O type. With a compact design and low power consumption, customers can enjoy enhanced efficiency and cost-effectiveness. Trust Microchip Technology for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for package body, making it suitable for various applications.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and reducing overall product size.

Operating Mode: SYNCHRONOUS

Allows for synchronized operation with other components, ensuring efficient data transfer.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption with nominal supply voltage of 1.8V, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high operating temperatures, ensuring reliable performance.

Memory IC Type: STANDARD SRAM

Reliable and widely-used memory type, ensuring compatibility with various systems.

Technical Specifications

SRAM 23A640-I/ST attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

16 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000001 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

23A640-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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