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NHPXA270C0C312

Marvell Technology

NHPXA270C0C312 by Marvell Technology

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

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Vyrian

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VNN

France . 108 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,679 parts In-Stock

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$8.000

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1,679

$8.000

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Semicontronic

India . 1,277 parts In-Stock

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$34.000

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$33.150

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$32.980

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1,277

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MARBEL Systems

Belgium . 771 parts In-Stock

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$45.651

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$43.825

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Texas Native Microelectronics

USA . 1,775 parts In-Stock

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$52.472

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$46.175

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Kenton Components

USA . 3,167 parts In-Stock

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$62.966

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$55.410

3,167

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Qasali Group International

UK . 30 parts In-Stock

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$141.674

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$124.673

30

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$124.673

Corphita

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Technical Specifications

Microprocessors NHPXA270C0C312 attributes and parameters. Explore more Microprocessors devices from Marvell Technology

Specs

Address Bus Width:

26

Boundary Scan:

YES

Maximum Clock Frequency:

13.002 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B360

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

360

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.59 mm

Speed:

312 rpm

Maximum Supply Voltage:

1.705 V

Minimum Supply Voltage:

1.1875 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

23 mm

Peripheral IC Type:

Trade Compliance

NHPXA270C0C312 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Marvell Technology

Marvell Technology is a leading fabless chipmaker focused on networking and storage applications. Marvell serves the data center, carrier, enterprise, automotive, and consumer end markets with processors, optical interconnections, application-specific integrated circuits (ASICs), and merchant silicon for Ethernet applications. The firm is an active acquirer, with five large acquisitions since 2017 helping it pivot out of legacy consumer applications to focus on the cloud and 5G markets.

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