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LCMXO256C-3MN100C

Lattice Semiconductor

LCMXO256C-3MN100C by Lattice Semiconductor

LCMXO256C-3MN100C by Lattice Semiconductor is a 256 Logic Cell FPGA with 32 CLBs and 78 Inputs/Outputs. Operating at 1.8V, it has a max temp of 85°C. Ideal for applications requiring high-speed processing in compact form factors.

Median Price

$11.670

Lifecycle Status

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Mouser Electronics

USA . 129 parts In-Stock

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$9.080

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DigiKey

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$11.940

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$9.625

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Bristol Electronics

USA . 305 parts In-Stock

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$9.232

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$5.539

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Ampacity Inc.

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Microchip USA

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Overview

Discover the power of the LCMXO256C-3MN100C by Lattice Semiconductor, a cutting-edge Field Programmable Gate Array that redefines versatility and performance. With its 256 logic cells and 32 CLBs, this FPGA offers endless possibilities for applications in various industries. Whether you're in telecommunications, automotive, or consumer electronics, this FPGA provides unmatched flexibility and reliability. Trust in Lattice Semiconductor's reputation for excellence and unlock the true potential of your designs with the LCMXO256C-3MN100C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the FPGA, ensuring reliable performance in various environments.

No. of Logic Cells: 256

Having 256 logic cells allows for complex programmable logic configurations and design flexibility in the FPGA.

Surface Mount: YES

Surface mount capability enables easy and secure installation of the FPGA on a printed circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 3.465 V

A higher maximum supply voltage of 3.465V provides a wider operating range for the FPGA, accommodating various power supply configurations.

No. of CLBs: 32

32 configurable logic blocks offer sufficient resources for implementing versatile functions and designs within the FPGA.

No. of Inputs: 78

With 78 inputs, the FPGA can handle a large number of signals and data inputs, making it suitable for complex systems requiring extensive connectivity.

Package Shape: SQUARE

A square package shape allows for efficient use of board space and easy integration into circuit layouts, optimizing PCB design.

Form Of Terminal: BALL

Ball terminals facilitate reliable connections and soldering during installation, ensuring stable electrical contact for optimal performance.

Nominal Supply Voltage (V): 1.8

A nominal supply voltage of 1.8V offers compatibility with common power supply standards, simplifying integration into existing systems.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages (1.8V and 3.3V) provides flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 100

Having 100 terminals enables extensive connectivity options and facilitates communication with other components in the system, enhancing versatility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for customization and reconfiguration of logic functions, making the FPGA versatile and adaptable to changing requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and compactness, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage of 1.71V ensures efficient power consumption and operation at lower voltage levels, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature range of up to 85°C allows the FPGA to withstand demanding environmental conditions and thermal stress, ensuring reliable performance in various applications.

Pitch Of Terminal: 0.5 mm

A small pitch of 0.5mm between terminals enables high-density packaging and efficient use of board space, maximizing integration possibilities.

Organization: 32 CLBS

The organization of 32 configurable logic blocks provides a structured framework for implementing complex logic functions and designs within the FPGA.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliable performance even in cold environments, making the FPGA suitable for a wide range of operating conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Using a finishing of tin, silver, and copper on terminals enhances conductivity, corrosion resistance, and solderability, ensuring robust electrical connections.

Position Of Terminal: BOTTOM

Bottom terminal positioning facilitates easy installation and soldering on the PCB, simplifying assembly and maintenance processes.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the FPGA is moderately sensitive to moisture, requiring proper handling and storage to maintain performance and reliability.

Maximum Seated Height: 1.35 mm

A low maximum seated height of 1.35mm allows for slim and compact designs, ideal for applications with space constraints or height limitations.

Width: 8 mm

An 8mm width offers a compact footprint for the FPGA, enabling easy integration into tight spaces and slim-profile electronic devices.

No. of Outputs: 78

Having 78 outputs allows the FPGA to drive multiple signals and data outputs, supporting complex system requirements and diverse communication needs.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures efficient and reliable soldering of the FPGA during assembly, preventing overheating or damage.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the FPGA can withstand high-temperature soldering processes, ensuring secure and durable connections on the PCB.

Length: 8 mm

An 8mm length provides a compact form factor for the FPGA, allowing for space-efficient placement on the PCB and streamlined system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO256C-3MN100C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

256

No. of Inputs:

78

No. of Outputs:

78

No. of CLBs:

32

Sub-Category:

Field Programmable Gate Arrays

Organization:

32 CLBS

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

3.465 V

Power Supplies:

1.8/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1.35 mm

Package Equivalence Code:

BGA100,14X14,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

100

Standards

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO256C-3MN100C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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