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LCMXO2-7000HE-6BG256I

Lattice Semiconductor

LCMXO2-7000HE-6BG256I by Lattice Semiconductor

LCMXO2-7000HE-6BG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 1.2V. It's used in applications requiring low profile, fine pitch grid array packages for high-performance computing.

Median Price

$18.555

Lifecycle Status

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Overview

Upgrade your projects with the LCMXO2-7000HE-6BG256I by Lattice Semiconductor, a top-tier Field Programmable Gate Array that offers unmatched performance and flexibility. With high-quality materials and cutting-edge technology, Lattice Semiconductor ensures reliability and innovation in every product. Ideal for a wide range of applications, this FPGA provides customers with the value and benefits they need to take their designs to the next level. Explore endless possibilities with the LCMXO2-7000HE-6BG256I and elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package is lightweight and durable, making the product easy to handle and resistant to damage.

No. of Logic Cells: 6864

With a large number of logic cells, this FPGA can handle complex calculations and operations efficiently.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.26 V

With a relatively low maximum supply voltage, this FPGA is energy-efficient and helps prevent overheating.

No. of Inputs: 206

Having a high number of inputs allows for versatile input signals and data processing capabilities.

Package Shape: SQUARE

The square shape of the package helps in easy handling and efficient placement on circuit boards.

Form Of Terminal: BALL

The ball terminals provide reliable connections and ease of soldering during installation.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage ensures consistent and stable operation of the FPGA.

Packing Method: TRAY

The tray packing method provides protection during shipping and storage, reducing the risk of damage.

Power Supplies (V): 1.2

Having a consistent power supply at 1.2 V ensures reliable performance of the FPGA.

No. of Terminals: 256

With a high number of terminals, this FPGA can support a range of connections for input and output devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable gate array, this product offers flexibility in design and customization for specific applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for compact and efficient integration on PCBs.

Minimum Supply Voltage: 1.14 V

With a low minimum supply voltage, the FPGA can operate efficiently even at lower power levels.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range ensures reliable operation in a variety of environments.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminals enables precise connections and space-saving in circuit board design.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable performance even in harsh cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper for terminal finishing ensures good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

The positioning of terminals at the bottom facilitates easy soldering and assembly on PCBs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this FPGA is suitable for moderate humidity environments, ensuring reliability in various conditions.

Maximum Seated Height: 1.7 mm

The low maximum seated height allows for slim and compact design options for the overall product assembly.

Width: 14 mm

With a width of 14 mm, this FPGA can fit into various PCB layouts and designs conveniently.

No. of Outputs: 206

Having a high number of outputs provides flexibility in connecting to external devices and circuits for data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and bonding during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C indicates the optimal temperature for soldering and ensures a reliable connection.

Length: 14 mm

With a length of 14 mm, this FPGA is compact and can be easily integrated into various electronic devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2-7000HE-6BG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

6864

No. of Inputs:

206

No. of Outputs:

206

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2-7000HE-6BG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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