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L0603C47NJRMST

KEMET Corporation

L0603C47NJRMST by KEMET Corporation

KEMET Corporation's L0603C47NJRMST is a fixed inductor with 0.047uH nominal inductance, 900MHz self-resonance frequency, and 85°C max operating temp. Ideal for RF applications, this SMT chip features dual-ended terminals and ceramic core construction.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,196 parts In-Stock

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4,196

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Bristol Electronics

USA . 3,896 parts In-Stock

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$0.300

1k+ parts

$0.120

10k+ parts

$0.090

3,896

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$0.300

$0.120

$0.090

Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 404 parts In-Stock

1+ parts

$1.050

100+ parts

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404

$1.050

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AZTECH Wire

Italy . 348 parts In-Stock

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$14.403

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348

$14.403

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your electronics with the L0603C47NJRMST by KEMET Corporation, a top-quality fixed inductor that offers exceptional performance and reliability. Perfect for RF applications, this multilayer chip inductor features a wraparound terminal shape and a compact 0603 case size for easy integration. With a nominal inductance of 0.047 uH and a self-resonance frequency of 900 MHz, this general-purpose inductor provides superior functionality. Trust KEMET Corporation for cutting-edge technology and unmatched innovation in electronic components. Experience the difference with the L0603C47NJRMST today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Terminal Placement: DUAL ENDED

Provides flexibility in circuit design and allows for easy connection to other components.

Test Frequency: 100 MHz

Ensures accurate and reliable performance at high frequencies, ideal for RF applications.

Case or Size Code: 0603

Compact size makes it suitable for small electronic devices and tight spaces.

Construction: Multilayer Chip

Ensures high inductance and low resistance, resulting in efficient operation.

Packing Method: TR

Tape and reel packaging simplifies the manufacturing and handling process.

Inductor Application: RF INDUCTOR

Specifically designed for use in radio frequency circuits, ensuring optimal performance.

Shape or Size Description: RECTANGULAR PACKAGE

Easy to integrate into PCB layouts and provides a stable mounting surface.

No. of Terminals: 2

Simple and straightforward connection to other components in the circuit.

Package Style (Meter): SMT

SMT packaging ensures compatibility with automated assembly processes.

Nominal Inductance (L): 0.047 uH

Provides the desired inductance value for effective signal filtering and tuning.

Terminal Shape: WRAPAROUND

Allows for secure and reliable solder connections for long-lasting performance.

Maximum Operating Temperature: 85 °C

Can operate effectively in a wide range of temperature environments.

Maximum Rated Current: 0.3 A

Capable of handling higher current loads without overheating or failure.

Minimum Quality Factor (at L-nom): 12

Ensures high efficiency and minimal signal loss in operation.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for various applications.

Terminal Finish: Matte Tin (Sn)

Provides a durable and corrosion-resistant surface for reliable electrical connections.

Inductor Type: GENERAL PURPOSE INDUCTOR

Versatile inductor suitable for a wide range of applications and circuit designs.

Self Resonance Frequency: 900 MHz

Designed for optimal performance in high-frequency applications such as wireless communication.

DC Resistance: 0.7 ohm

Low resistance ensures minimal power loss and efficient energy transfer.

Core Material: CERAMIC

Provides high stability, reliability, and temperature resistance for consistent performance.

Package Height: 0.8 mm

Low profile design for space-constrained applications.

Tolerance: 5 %

Provides a level of accuracy and reliability for consistent performance.

Package Length: 1.6 mm

Compact footprint suitable for small electronic devices.

Package Width: 0.8 mm

Space-saving design for efficient PCB layout and assembly.

Technical Specifications

Fixed Inductors L0603C47NJRMST attributes and parameters. Explore more Fixed Inductors devices from KEMET Corporation

Inductor Specifications

Inductor Type:

Inductor Application:

Nominal Inductance:

47 nH

Maximum Rated Current:

300 mA

Minimum Quality Factor (at L-nom):

12

DC Resistance:

700 mΩ

Tolerance:

5 %

No. of Functions:

1

Self Resonance Frequency:

900 MHz

Test Frequency:

100 MHz

Physical Characteristics

Package Shape:

Rectangular Package

Case or Size Code:

0603

Shielded:

No

Construction:

Multi-Layer

Core Material:

Ceramic

Surface Mounted:

Yes

Thermal Characteristics

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Terminal Characteristics

Terminal Position:

Dual Ended

Terminal Shape:

Wraparound

Terminal Finish:

Matte Tin

No. of Terminals:

2

Packaging & Delivery

Package Style:

SMT

Package Length:

0.063 in (1.6 mm)

Package Height:

0.031 in (0.8 mm)

Package Width:

0.031 in (0.8 mm)

Packing Method:

Tape and Reel

Standards

JESD-609 Code:

e3

Trade Compliance

L0603C47NJRMST Inductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

PCN

Manufacturer Highlights

KEMET Corporation

KEMET Corporation is an American electronics company that specializes in the design, manufacturing, and distribution of capacitors, electromagnetic compatibility solutions, and other electronic components. The company was founded in 1919 and is headquartered in Fort Lauderdale, Florida, with manufacturing facilities and sales offices around the world. KEMET Corporation and its subsidiaries (KEMET), is a wholly owned subsidiary of Yageo Corporation (TAIEX: 2327).

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Management team

CEO

William M. Lowe, Jr.

Executive VP & CFO

Gregory C. Thompson

Executive VP & President - TOKIN Corporation

Shigenori (Sean) Oyama

Manufacturer fab locations 25

Fab name Location Fab Initiation Wafer Capacity

Advanced Tantalum Manufacturing

Fabrication

Fab Initiation

-

USA

Simpsonville

Wafer Capacity

382

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382

FELCO

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-

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Chicago

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USA

Fort Lauderdale

Wafer Capacity

61

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61

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Indonesia

Batam

Wafer Capacity

68

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68

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China

Anting-Shanghai

Wafer Capacity

73

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73

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Mexico

Matamoros

Wafer Capacity

286

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286

-

Fabrication

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Mexico

Ciudad Victoria

Wafer Capacity

265

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265

Guadalupe

Fabrication

Fab Initiation

-

Mexico

Monterrey

Wafer Capacity

532

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532

San Nicolas

Fabrication

Fab Initiation

-

Mexico

Monterrey

Wafer Capacity

-

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Fabrication

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-

North Macedonia

Skopje

Wafer Capacity

126

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126

Plant A

Fabrication

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-

China

Suzhou

Wafer Capacity

353

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353

Plant B

Fabrication

Fab Initiation

-

China

Suzhou

Wafer Capacity

-

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Fabrication

Fab Initiation

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China

Xiamen

Wafer Capacity

432

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432

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Fabrication

Fab Initiation

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Italy

Pontecchio

Wafer Capacity

226

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226

-

Fabrication

Fab Initiation

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Portugal

Evora

Wafer Capacity

233

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233

TOKIN

Fabrication

Fab Initiation

-

Vietnam

Biên Hòa City

Wafer Capacity

174

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174

TOKIN

Fabrication

Fab Initiation

-

Thailand

Hom Sin

Wafer Capacity

-

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Thailand

Chachoengsao

Wafer Capacity

171

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171

TOKIN

Fabrication

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Japan

Sendai

Wafer Capacity

378

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378

TOKIN

Fabrication

Fab Initiation

-

Japan

Toyama

Wafer Capacity

-

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Japan

Nyuzen

Wafer Capacity

209

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209

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Fab Initiation

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Japan

Shiroishi

Wafer Capacity

378

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378

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Fab Initiation

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Finland

Suomussalmi

Wafer Capacity

56

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56

-

Fabrication

Fab Initiation

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Bulgaria

Kyustendil

Wafer Capacity

86

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86

-

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Fab Initiation

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Sweden

Farjestaden

Wafer Capacity

28

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28

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