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STBV32/B

Jiangsu Changjiang Electronics Technology

STBV32/B by Jiangsu Changjiang Electronics Technology

NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1.1 W; Maximum Collector Current (IC): 1 A; Maximum Collector-Emitter Voltage: 400 V;

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,357 parts In-Stock

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3,357

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Digiode

USA . 1,786 parts In-Stock

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1,786

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Anansix

USA . 819 parts In-Stock

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819

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IDEA Electronic Components Group

UK . 1,884 parts In-Stock

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$0.317

100+ parts

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$0.286

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1,884

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MKK Technologies

India . 286 parts In-Stock

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$0.597

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286

$0.597

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DigiPath Technology Company

USA . 286 parts In-Stock

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$0.597

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286

$0.597

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Corphita

USA . 1,166 parts In-Stock

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1,166

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Parana Technologies

USA . 301 parts In-Stock

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$0.380

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301

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$0.380

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Technical Specifications

Power Bipolar Junction Transistors (BJT) STBV32/B attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Jiangsu Changjiang Electronics Technology

Specs

Maximum Collector Current (IC):

1 A

Maximum Collector-Emitter Voltage:

400 V

Configuration:

Minimum DC Current Gain (hFE):

5

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-W3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

1.1 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum VCEsat:

1.5 V

Trade Compliance

STBV32/B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Jiangsu Changjiang Electronics Technology

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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