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ISL73127RHVF

Intersil

ISL73127RHVF by Intersil

RF Power Bipolar Transistors; Terminal Finish: Gold (Au); Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;

Median Price

$1.671

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$1.671

100+ parts

-

1k+ parts

-

10k+ parts

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650

$1.671

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.228

100+ parts

$2.027

1k+ parts

$1.827

10k+ parts

-

1,000

$2.228

$2.027

$1.827

-

Supply Digital

USA . 2,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,561

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Technical Specifications

RF Power Bipolar Junction Transistors (BJT) ISL73127RHVF attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from Intersil

Specs

JESD-609 Code:

e4

Peak Reflow Temperature (C):

260

Terminal Finish:

Gold (Au)

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ISL73127RHVF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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