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CDP68HC68T1MZ

Intersil

CDP68HC68T1MZ by Intersil

TIMER, REAL TIME CLOCK; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$12.082

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$10.740

1k+ parts

$9.610

10k+ parts

$9.040

78

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$10.740

$9.610

$9.040

Verical

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$13.425

1k+ parts

$12.012

10k+ parts

$11.300

78

-

$13.425

$12.012

$11.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$10.430

100+ parts

-

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100

$10.430

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Vyrian

USA . 462 parts In-Stock

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462

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ComSIT Distribution GmbH

Germany . 76 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 96 parts In-Stock

1+ parts

$10.170

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$10.170

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Semicontronic

India . 67 parts In-Stock

1+ parts

$10.170

100+ parts

$9.916

1k+ parts

$9.865

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-

67

$10.170

$9.916

$9.865

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Continental Prestige Electronics

USA . 1,029 parts In-Stock

1+ parts

$10.430

100+ parts

-

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$10.221

1,029

$10.430

-

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$10.221

Advanced Electronics

New Zealand . 24 parts In-Stock

1+ parts

$12.099

100+ parts

$11.131

1k+ parts

$10.430

10k+ parts

-

24

$12.099

$11.131

$10.430

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AZTECH Wire

Italy . 462 parts In-Stock

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$14.732

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462

$14.732

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Corohmni

South Africa . 94 parts In-Stock

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$17.831

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$17.831

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Aztec Data Supply Inc.

USA . 217 parts In-Stock

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$30.381

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217

$30.381

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QUARKTWIN TECHNOLOGY LTD

USA . 21,482 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 3,229 parts In-Stock

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3,229

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Supply Digital

USA . 2,870 parts In-Stock

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2,870

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Perfect Parts

USA . 2,275 parts In-Stock

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Argo Parts USA

USA . 998 parts In-Stock

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998

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Kepictronics

USA . 236 parts In-Stock

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Technical Specifications

Timers & Real-Time Clocks CDP68HC68T1MZ attributes and parameters. Explore more Timers & Real-Time Clocks devices from Intersil

Specs

Maximum Clock Frequency:

4.1943 MHz

Information Access Method:

SERIAL, 3-WIRE

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Timers or RTCs

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Volatile:

YES

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

CDP68HC68T1MZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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