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PEF7072HLV16

Intel

PEF7072HLV16 by Intel

Intel's PEF7072HLV16 is a telecom IC with 64 terminals in a rectangular flatpack package. It features gull wing terminals and is designed for telecom circuit applications. The surface-mountable IC is made of plastic/epoxy material, making it suitable for various telecommunications interface functions.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,691 parts In-Stock

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-

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$1.240

1k+ parts

$1.110

10k+ parts

$1.050

14,691

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$1.240

$1.110

$1.050

Distributors (In-Stock)

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Vyrian

USA . 1,552 parts In-Stock

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1,552

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Digiode

USA . 360 parts In-Stock

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360

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 17,656 parts In-Stock

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$1.110

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$1.110

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$7.166

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$6.521

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$5.876

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300

$7.166

$6.521

$5.876

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MARBEL Systems

Belgium . 6,536 parts In-Stock

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$7.997

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$7.997

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Texas Native Microelectronics

USA . 75 parts In-Stock

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$9.192

100+ parts

$8.824

1k+ parts

$8.549

10k+ parts

$8.089

75

$9.192

$8.824

$8.549

$8.089

Kenton Components

USA . 172 parts In-Stock

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$11.030

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$9.707

172

$11.030

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$9.707

Qasali Group International

UK . 21 parts In-Stock

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$24.818

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$23.081

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$21.840

21

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$21.840

Argo Parts USA

USA . 3,922 parts In-Stock

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Microchip USA

USA . 2,963 parts In-Stock

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Continental Prestige Electronics

USA . 2,830 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Corphita

USA . 61 parts In-Stock

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Overview

Upgrade your telecom systems with the PEF7072HLV16 by Intel. Designed with quality and reliability in mind, this telecom interface IC offers seamless integration and enhanced performance for various applications. Whether you are looking to improve communication systems or optimize network connectivity, this product delivers unmatched value and benefits to customers. Trust Intel, a renowned manufacturer, to provide cutting-edge solutions that meet your needs and exceed your expectations. Experience the difference with the PEF7072HLV16 and take your telecom systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and heat resistance, making the product reliable for long-term usage.

Surface Mount: YES

Surface mount components are easier to assemble on circuit boards, reducing manufacturing time and costs.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and allow for easy placement on circuit boards, optimizing design layouts.

No. of Terminals: 64

Having a high number of terminals allows for more connections and functionality within the IC, offering greater capabilities for telecom applications.

Package Style (Meter): FLATPACK

Flatpack packages provide a low profile design, saving space in electronic devices and enabling compact designs for telecom equipment.

Terminal Position: QUAD

Quad terminal positions allow for efficient routing of connections within the IC, improving signal integrity and performance.

Terminal Form: GULL WING

Gull wing terminals are robust and reliable for surface mounting, ensuring secure connections in telecom interfaces.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC provides optimized functionality and performance for telecommunications interfaces.

Technical Specifications

Other Function Telecom Interface ICs PEF7072HLV16 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Intel

Specs

JESD-30 Code:

R-PQFP-G64

No. of Functions:

1

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

PEF7072HLV16 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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