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MR27256-17

Intel

MR27256-17 by Intel

UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 435 parts In-Stock

1+ parts

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435

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Digiode

USA . 434 parts In-Stock

1+ parts

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434

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Distributors (Availability)

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MARBEL Systems

Belgium . 11 parts In-Stock

1+ parts

$2.471

100+ parts

-

1k+ parts

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10k+ parts

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11

$2.471

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Texas Native Microelectronics

USA . 3,865 parts In-Stock

1+ parts

$2.840

100+ parts

$2.726

1k+ parts

$2.641

10k+ parts

$2.499

3,865

$2.840

$2.726

$2.641

$2.499

Kenton Components

USA . 67 parts In-Stock

1+ parts

$3.408

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10k+ parts

$2.999

67

$3.408

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$2.999

Qasali Group International

UK . 26,805 parts In-Stock

1+ parts

$7.668

100+ parts

-

1k+ parts

$7.131

10k+ parts

$6.748

26,805

$7.668

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$7.131

$6.748

Corphita

USA . 269 parts In-Stock

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269

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Technical Specifications

EPROM MR27256-17 attributes and parameters. Explore more EPROM devices from Intel

Specs

Maximum Access Time:

170 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XQCC-N32

JESD-609 Code:

e0

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC32,.45X.55

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Sub-Category:

EPROMs

Maximum Supply Current:

140 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

MR27256-17 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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