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EP3SE50F484C3G

Intel

EP3SE50F484C3G by Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

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3

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1k+

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Chip Stock

USA . 1,487 parts In-Stock

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Digiode

USA . 343 parts In-Stock

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343

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Vyrian

USA . 155 parts In-Stock

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155

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Texas Native Microelectronics

USA . 3,398 parts In-Stock

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$149.074

100+ parts

$143.111

1k+ parts

$138.639

10k+ parts

$131.185

3,398

$149.074

$143.111

$138.639

$131.185

Kenton Components

USA . 811 parts In-Stock

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$178.889

100+ parts

$171.733

1k+ parts

$166.367

10k+ parts

$157.422

811

$178.889

$171.733

$166.367

$157.422

Qasali Group International

UK . 38 parts In-Stock

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$402.500

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38

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Microchip USA

USA . 2,251 parts In-Stock

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$1,906.567

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Corphita

USA . 126 parts In-Stock

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126

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MARBEL Systems

Belgium . 100 parts In-Stock

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SE50F484C3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

47500

No. of Inputs:

296

No. of Outputs:

296

No. of CLBs:

1900

Organization:

1900 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

3 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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