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EP2AGX45DF29I5N

Intel

EP2AGX45DF29I5N by Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE;

Median Price

$665.330

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5

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1k+

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DigiKey

USA . 36 parts In-Stock

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Digiode

USA . 1,270 parts In-Stock

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$632.064

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Vyrian

USA . 1,080 parts In-Stock

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Component Sense

UK . 1 parts In-Stock

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Flip Electronics

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Native Components

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Northwest PG Solutions

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Modulus Dynamics

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$38.372

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MARBEL Systems

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$70.234

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$67.425

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Kenton Components

USA . 100 parts In-Stock

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$85.250

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Texas Native Microelectronics

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$96.763

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$93.739

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Microchip USA

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$499.635

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One Stop Electronics

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Semicontronic

India . 36 parts In-Stock

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$565.530

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$551.392

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$548.564

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Corphita

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Corohmni

South Africa . 500 parts In-Stock

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Glotronic Ltd.

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Supply Digital

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Qasali Group International

UK . 1,711 parts In-Stock

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Vigor

Singapore . 398 parts In-Stock

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Kepictronics

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Perfect Parts

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2AGX45DF29I5N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

42959

No. of Inputs:

372

No. of Outputs:

372

No. of CLBs:

1805

Maximum Clock Frequency:

500 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

1805 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9,1.2/3.3,1.5,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2AGX45DF29I5N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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