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EP1S30F780C8

Intel

EP1S30F780C8 by Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE;

Median Price

$446.540

Lifecycle Status

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Arrow

USA . 72 parts In-Stock

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$446.540

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$379.560

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Verical

USA . 72 parts In-Stock

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Digiode

USA . 1,122 parts In-Stock

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$424.213

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Vyrian

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Flip Electronics

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Touchstone Systems

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Prism Electronics

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Bristol Electronics

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Atlantic Semiconductor

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Native Components

USA . 810 parts In-Stock

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$0.046

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Andel Nordic

Denmark . 5,409 parts In-Stock

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$1.660

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$1.164

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Modulus Dynamics

Lithuania . 1,640 parts In-Stock

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$20.929

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

UK . 300 parts In-Stock

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One Stop Electronics

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Semicontronic

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Corphita

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Corohmni

South Africa . 375 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

Germany . 4,829 parts In-Stock

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Supply Digital

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Northwest PG Solutions

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Vigor

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Perfect Parts

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Speed Components Ltd (Excess)

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP1S30F780C8 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

32470

No. of Inputs:

726

No. of Outputs:

726

No. of CLBs:

3819

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3819 CLBS

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EP1S30F780C8 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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