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AGIB027R31B2I3V

Intel

AGIB027R31B2I3V by Intel

Intel AGIB027R31B2I3V is a SoC FPGA with 3184 terminals, operating from -40 to 100°C. It features a plastic/epoxy package body, rectangular shape, and surface-mount capability. Ideal for applications requiring high-performance computing in harsh environments.

Median Price

$82,365.062

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 17 parts In-Stock

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Vyrian

USA . 6,369 parts In-Stock

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Chip Stock

USA . 1,248 parts In-Stock

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VNN

France . 836 parts In-Stock

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Digiode

USA . 272 parts In-Stock

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AZTECH Wire

Italy . 723 parts In-Stock

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$5.202

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Ampacity Inc.

Singapore . 1,424 parts In-Stock

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$13.000

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MARBEL Systems

Belgium . 23,689 parts In-Stock

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$30.982

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Texas Native Microelectronics

USA . 3,092 parts In-Stock

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$35.612

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$31.339

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Kenton Components

USA . 366 parts In-Stock

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$42.734

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$37.606

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Qasali Group International

UK . 247 parts In-Stock

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$96.152

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$84.614

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Microchip USA

USA . 100 parts In-Stock

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$43,375.640

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Argo Parts USA

USA . 3,675 parts In-Stock

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$82,365.062

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$81,541.412

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$80,717.761

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$79,894.111

3,675

$82,365.062

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$80,717.761

$79,894.111

Continental Prestige Electronics

USA . 1,924 parts In-Stock

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$82,365.062

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$80,717.761

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

USA . 196 parts In-Stock

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Overview

Unleash the power of innovation with the AGIB027R31B2I3V by Intel. This cutting-edge product sets the standard for quality and reliability in the category of Other Function uPs, uCs & Peripheral ICs. With a robust package body material of PLASTIC/EPOXY and 3184 terminals, this SoC FPGA offers unparalleled performance in a wide range of applications. From advanced robotics to data processing, the AGIB027R31B2I3V delivers exceptional value and benefits to customers seeking top-tier technology solutions. Experience the advantage of Intel's expertise and elevate your projects to new heights with this revolutionary product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the integrated circuits inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards, maximizing use of available space.

No. of Terminals: 3184

Having a large number of terminals enables connectivity with a wide range of external components, making this product versatile.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in cold environments without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and allows for easier access during maintenance or troubleshooting.

Peripheral IC Type: SoC FPGA

This SoC FPGA type provides high processing power and flexibility, making it suitable for applications requiring complex calculations and rapid data processing.

Terminal Form: BALL

The ball terminal form facilitates efficient soldering and ensures reliable connections, contributing to the overall durability and performance of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AGIB027R31B2I3V attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

JESD-30 Code:

R-PBGA-B3184

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

AGIB027R31B2I3V Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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