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5CGXFC7D6F31I7

Intel

5CGXFC7D6F31I7 by Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

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3

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1k+

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Vyrian

USA . 2,092 parts In-Stock

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Digiode

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One Stop Electronics

USA . 1,229 parts In-Stock

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$14.000

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Ampacity Inc.

Singapore . 423 parts In-Stock

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$15.000

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Semicontronic

India . 393 parts In-Stock

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MARBEL Systems

Belgium . 1,905 parts In-Stock

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$66.735

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Modulus Dynamics

Lithuania . 1,787 parts In-Stock

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Texas Native Microelectronics

USA . 4,153 parts In-Stock

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Kenton Components

USA . 220 parts In-Stock

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Corohmni

South Africa . 1,196 parts In-Stock

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Microchip USA

USA . 2,530 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,937 parts In-Stock

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Corphita

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Supply Digital

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Northwest PG Solutions

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Native Components

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Qasali Group International

UK . 246 parts In-Stock

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Perfect Parts

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Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGXFC7D6F31I7 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

150000

No. of Inputs:

480

No. of Outputs:

480

No. of CLBs:

5648

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5648 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA896,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

896

Standards

JESD-30 Code:

S-PBGA-B896

Qualified:

No

Trade Compliance

5CGXFC7D6F31I7 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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