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5CGTFD7D5F31C7N

Intel

5CGTFD7D5F31C7N by Intel

Intel's 5CGTFD7D5F31C7N FPGA boasts 149.5K logic cells, 480 inputs/outputs, and operates at a max voltage of 1.13V. Ideal for applications requiring high-speed data processing in compact spaces due to its square shape, grid array package style, and low power consumption.

Median Price

$498.543

Lifecycle Status

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Verical

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Nova Conductors

Japan . 100 parts In-Stock

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France . 3,690 parts In-Stock

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Ampacity Inc.

Singapore . 407 parts In-Stock

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AZTECH Wire

Italy . 220 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 235 parts In-Stock

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Modulus Dynamics

Lithuania . 448 parts In-Stock

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Kenton Components

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Texas Native Microelectronics

USA . 1,010 parts In-Stock

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Advanced Electronics

New Zealand . 150 parts In-Stock

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Corohmni

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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Futuretech Components

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Overview

Unlock limitless possibilities with the Intel 5CGTFD7D5F31C7N FPGA, a cutting-edge solution that combines high-quality construction with exceptional performance. Manufactured by Intel, a trusted leader in technology, this FPGA boasts 149500 logic cells and 480 inputs, perfect for a wide range of applications. With a square package shape and grid array style, this versatile product offers unparalleled value and benefits to customers looking to innovate and excel in their projects. Embrace the future of technology with the Intel 5CGTFD7D5F31C7N FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY:

The use of plastic/epoxy material makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 149500:

With a high number of logic cells, this FPGA is capable of handling complex logic operations efficiently.

Surface Mount: YES:

Being surface mountable, this FPGA is easy to install on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.13 V:

The low maximum supply voltage allows for reduced power consumption and heat generation, increasing energy efficiency.

Technology Used: CMOS:

Utilizing CMOS technology ensures low power consumption and fast operation, making this FPGA suitable for various applications.

No. of Inputs: 480:

The high number of inputs allows for a wide range of input signals to be processed, increasing flexibility and functionality.

Package Shape: SQUARE:

The square package shape is space-efficient and facilitates easy integration into different system designs.

Form Of Terminal: BALL:

Ball terminals provide reliable connections and easy soldering, ensuring stable performance and durability.

Nominal Supply Voltage (V): 1.1:

A consistent nominal supply voltage of 1.1V ensures stable and reliable operation of the FPGA.

Power Supplies (V): 1.1,1.2/3.3,2.5:

The availability of multiple power supply options allows for compatibility with various systems and voltage requirements.

No. of Terminals: 896:

With a high number of terminals, this FPGA offers ample connectivity options, making it suitable for complex designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY:

This programmable IC type allows for flexibility in configuring the logic functions, making it adaptable to different applications.

Package Style (Meter): GRID ARRAY:

The grid array package style provides high-density mounting, optimal signal routing, and improved thermal performance.

Minimum Supply Voltage: 1.07 V:

The low minimum supply voltage ensures reliable operation even under low power conditions, enhancing the FPGA's performance.

Maximum Operating Temperature: 85 °C:

With a maximum operating temperature of 85°C, this FPGA can withstand elevated temperatures, suitable for industrial applications.

Pitch Of Terminal: 1 mm:

The small pitch of terminals enables high-density packaging, reducing space requirements and enabling compact designs.

Minimum Operating Temperature: 0 °C:

The FPGA's ability to operate at a minimum temperature of 0°C makes it suitable for various environments and applications.

Finishing Of Terminal Used: TIN SILVER COPPER:

The use of tin, silver, and copper finishing on terminals ensures high conductivity, corrosion resistance, and reliability.

Position Of Terminal: BOTTOM:

Terminals positioned at the bottom facilitate easy PCB mounting and soldering, simplifying the installation process.

Moisture Sensitivity Level (MSL): 3:

With an MSL of 3, this FPGA can withstand moderate levels of moisture exposure during storage and handling.

Maximum Seated Height: 2 mm:

The low maximum seated height of 2mm allows for slim and compact PCB designs, saving space in electronic devices.

Width: 31 mm:

The width of 31mm provides a compact form factor, making this FPGA suitable for applications with limited space.

No. of Outputs: 480:

With a high number of outputs, this FPGA can deliver diverse output signals, increasing versatility and functionality.

Length: 31 mm:

The length of 31mm contributes to the FPGA's compact size, enabling integration into various electronic systems efficiently.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGTFD7D5F31C7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

149500

No. of Inputs:

480

No. of Outputs:

480

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA896,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

896

Standards

JESD-30 Code:

S-PBGA-B896

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5CGTFD7D5F31C7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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