Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Intel's 5CGTFD5C5F27C7N FPGA boasts 76500 logic cells, 368 inputs/outputs, and operates at a max voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications and automotive industries.
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This material is durable and provides protection to the internal components of the FPGA, ensuring longevity and reliability.
The high number of logic cells allows for complex programmable logic designs to be implemented effectively, making this FPGA suitable for a wide range of applications.
Surface mount technology makes it easier to assemble and integrate the FPGA onto printed circuit boards, saving time and effort during production.
The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA more energy-efficient.
CMOS technology offers high performance, low power consumption, and compatibility with a wide range of digital systems, making it a versatile choice for FPGA applications.
With a high number of inputs, the FPGA can accommodate a large number of external signals and data inputs, making it suitable for data-intensive applications.
The square shape of the package allows for efficient use of board space, enabling compact and space-saving designs when integrating the FPGA onto circuit boards.
Ball terminals provide reliable electrical connections and are well-suited for fine pitch applications, ensuring secure and stable connections in the FPGA.
The nominal supply voltage of 1.1V ensures stable and consistent power delivery to the FPGA, maintaining reliable operation throughout its lifespan.
Support for multiple power supply voltages allows for flexible power management options, enabling the FPGA to be optimized for different performance requirements and power consumption levels.
The high number of terminals provides ample connectivity options for interfacing with other components and peripherals, making the FPGA versatile and adaptable to various system configurations.
Being a field-programmable device, this FPGA offers reconfigurability and adaptability, allowing for quick design changes and updates without the need for hardware changes.
The grid array package style offers high interconnection density, enabling efficient signal routing and reducing signal propagation delays, leading to improved performance of the FPGA.
The low minimum supply voltage ensures reliable operation at lower power levels, contributing to the energy efficiency and overall reliability of the FPGA.
The high maximum operating temperature tolerance makes this FPGA suitable for applications that require extended temperature range operation, ensuring reliable performance in harsh environmental conditions.
The fine pitch of 1mm allows for high-density packaging and closer spacing of terminals, enabling compact and space-efficient integration of the FPGA onto circuit boards.
The low minimum operating temperature tolerance ensures reliable operation even in cold environments, making the FPGA suitable for a wide range of temperature conditions.
The use of tin, silver, and copper finishing on terminals provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections in the FPGA.
Bottom terminals facilitate easy mounting and soldering of the FPGA onto circuit boards, making the assembly process efficient and hassle-free.
MSL level 3 indicates that the FPGA has moderate sensitivity to moisture, requiring standard precautions during handling and storage to prevent moisture-related damage.
The low seated height of 2mm allows for compact and slim designs when integrating the FPGA onto circuit boards, saving space and enabling high-density packaging.
The width of 27mm provides a compact form factor for the FPGA, enabling easy integration into tight spaces and efficient layout designs on circuit boards.
With a high number of outputs, the FPGA can drive multiple external devices and interfaces, facilitating complex signal processing and data communication tasks in various applications.
The length of 27mm complements the width and form factor of the FPGA, ensuring a balanced and space-efficient package size for easy integration into circuit board designs.
Field Programmable Gate Arrays (FPGA) 5CGTFD5C5F27C7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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5CGTFD5C5F27C7N Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev Software Chgs 3/Jun/2021 Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
1N4148
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
1N4148WS
Sensitron Semiconductor
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
Jiangsu Jiejie Microelectronics
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Changzhou Starsea Electronics
M85049/85-08W02
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
LCMXO3LF-4300E-5MG256C
Lattice Semiconductor
LCMXO3LF-4300E-5MG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, suitable for applications requiring high performance in a compact form factor. With a package style of GRID ARRAY and very thin profile, it operates b/w 0 to 85°C temperatures, making it ideal for various industrial and consumer electronics projects.
EP3C5E144I7N
Intel
EP3C5E144I7N by Intel is a CMOS FPGA with 5136 logic cells, 94 inputs/outputs, and operates at temperatures from -40 to 100°C. It comes in a rectangular package with gull wing terminals, suitable for industrial applications requiring high-performance programmable ICs. With a low profile and fine pitch style, it offers flexibility and reliability in various electronic designs.
LCMXO3LF-9400C-6BG256C
LCMXO3LF-9400C-6BG256C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and operating temp up to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.
LCMXO2-7000HC-4TG144I
LCMXO2-7000HC-4TG144I by Lattice Semiconductor is a FPGA with 6864 logic cells, 114 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-density programmable ICs in compact spaces with operating temperatures ranging from -40 to 100°C.
XC7S15-1FTGB196I
Xilinx
Xilinx XC7S15-1FTGB196I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing.
XCAU10P-2SBVB484I
FIELD PROGRAMMABLE GATE ARRAY;
EP3C55F484C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
XC7A100T-1FGG484C
Xilinx XC7A100T-1FGG484C is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. Operating at max frequency of 1098 MHz, it's ideal for high-performance applications requiring fast combinatorial delay of 1.27 ns in a compact package style suitable for surface mount technology.
XC3S50AN-4TQG144CES
XC3S50AN-4TQG144CES by Xilinx is a 176 CLB, 50000 gates FPGA with max clock freq of 280 MHz. Operating at 3.3V nominal voltage, it's ideal for applications requiring high-speed processing and programmable logic in compact form factors. Package style: Flatpack, low profile, fine pitch.
EP2C8F256C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
XC7S50-1CSGA324I
The Xilinx XC7S50-1CSGA324I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.
EP4CE10F17C8N
EP4CE10F17C8N by Altera is a PLASTIC/EPOXY FPGA with 10320 logic cells, 179 inputs/outputs, and a maximum clock frequency of 472.5 MHz. It operates at a supply voltage of 1.2V and is suitable for various applications requiring high-speed data processing and programmable logic capabilities.
A3PE1500-PQG208I
Microchip Technology
A3PE1500-PQG208I by Microchip Technology is a CMOS FPGA with 38400 logic cells and 1500000 equivalent gates. It operates at a supply voltage of 1.5V, suitable for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 28mm square package.
XC6SLX45-2CSG324I
The Xilinx XC6SLX45-2CSG324I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100 °C and is suitable for industrial applications requiring high-speed processing in compact form factors.
XC6SLX25T-3CSG324I
Xilinx XC6SLX25T-3CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages ranging from 1.14V to 2.5/3.3V, making it versatile for various electronic designs.
EP1C6Q240C6N
EP1C6Q240C6N by Intel is a Field Programmable Gate Array (FPGA) with 5980 logic cells and 598 CLBs. It operates at a max clock frequency of 405 MHz, making it suitable for high-speed applications in industries like telecommunications and signal processing. With a package style of flatpack and fine pitch, this FPGA offers versatility in design while maintaining compact dimensions.
5CEBA2F23C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFXP2-8E-5QN208C
LFXP2-8E-5QN208C by Lattice Semiconductor is a 1.2V FPGA with 8000 logic cells, 1000 CLBs, and 146 inputs/outputs. It operates at up to 435MHz clock frequency and has a max operating temperature of 85°C. Ideal for applications requiring high-speed processing in compact designs.
XC7A75T-3FGG484E
Xilinx XC7A75T-3FGG484E FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1412 MHz. Ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package with a low combinatorial delay of 0.94 ns.
XC6SLX45-3CSG324C
The Xilinx XC6SLX45-3CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at a max frequency of 862 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability under varying operating conditions.
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5CGTFD7C5F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;
The Altera 5CGTFD7C5F23I7N is a Field Programmable Gate Array (FPGA) with 150,000 logic cells, 5,648 configurable logic blocks (CLBs), and 240 inputs and outputs. It operates at a maximum supply voltage of 1.13V and supports a nominal supply voltage of 1.1V. The package is a BGA484 with a grid array style and a square shape, measuring 23mm in width and length. It can withstand temperatures from -40°C to 100°C and has a maximum seated height of 2mm. The FPGA is suitable for various applications that require programmable ICs, such as digital signal processing, high-performance computing, and communication systems.
5CGTFD5C5F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.13 V;
The Altera 5CGTFD5C5F23I7N is a CMOS FPGA with 76500 logic cells. It has a maximum supply voltage of 1.13V and can be surface mounted. Its package shape is square and it uses a BGA484 package code. The FPGA has 240 inputs and outputs, and its dimensions are 23mm x 23mm.
5CGTFD7D5F31C7N
Intel's 5CGTFD7D5F31C7N FPGA boasts 149.5K logic cells, 480 inputs/outputs, and operates at a max voltage of 1.13V. Ideal for applications requiring high-speed data processing in compact spaces due to its square shape, grid array package style, and low power consumption.
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;
5CGTFD7D5F27I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;
Intel's 5CGTFD7D5F27I7N FPGA boasts 149500 logic cells, 336 inputs/outputs, and a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementation in fields like telecommunications, aerospace, and automotive industries.
5CGTFD9C5F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 230;
5CGTFD7C5U19I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
5CGTFD5C5M13I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 383; Package Code: TFBGA; Package Shape: SQUARE;
5CGTFD9E5F35C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
5CGTFD5C5F27C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
5CGTFD5C5F23C7N
5CGTFD5C5F23C7
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