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5CGTFD5C5F27C7N

Intel

5CGTFD5C5F27C7N by Intel

Intel's 5CGTFD5C5F27C7N FPGA boasts 76500 logic cells, 368 inputs/outputs, and operates at a max voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications and automotive industries.

Median Price

$245.385

Lifecycle Status

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Digiode

USA . 625 parts In-Stock

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MARBEL Systems

Belgium . 4,472 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 1,147 parts In-Stock

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Qasali Group International

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Ampacity Inc.

Singapore . 10 parts In-Stock

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Corphita

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Corohmni

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Microchip USA

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One Stop Electronics

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Semicontronic

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Component Stockers USA

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

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Supply Digital

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Overview

Unleash the power of innovation with the 5CGTFD5C5F27C7N by Intel! This cutting-edge Field Programmable Gate Array (FPGA) offers unmatched flexibility and performance, making it ideal for a wide range of applications. With 76500 logic cells and 368 inputs/outputs, this FPGA delivers unparalleled customization options for your projects. Intel's reputation for quality and reliability ensures that you can trust in the durability and longevity of this product. Experience the benefits of advanced technology and seamless integration with the 5CGTFD5C5F27C7N - the perfect solution for all your FPGA needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection to the internal components of the FPGA, ensuring longevity and reliability.

No. of Logic Cells: 76500

The high number of logic cells allows for complex programmable logic designs to be implemented effectively, making this FPGA suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology makes it easier to assemble and integrate the FPGA onto printed circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.13 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA more energy-efficient.

Technology Used: CMOS

CMOS technology offers high performance, low power consumption, and compatibility with a wide range of digital systems, making it a versatile choice for FPGA applications.

No. of Inputs: 368

With a high number of inputs, the FPGA can accommodate a large number of external signals and data inputs, making it suitable for data-intensive applications.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space, enabling compact and space-saving designs when integrating the FPGA onto circuit boards.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and are well-suited for fine pitch applications, ensuring secure and stable connections in the FPGA.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage of 1.1V ensures stable and consistent power delivery to the FPGA, maintaining reliable operation throughout its lifespan.

Power Supplies (V): 1.1, 1.2/3.3, 2.5

Support for multiple power supply voltages allows for flexible power management options, enabling the FPGA to be optimized for different performance requirements and power consumption levels.

No. of Terminals: 672

The high number of terminals provides ample connectivity options for interfacing with other components and peripherals, making the FPGA versatile and adaptable to various system configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers reconfigurability and adaptability, allowing for quick design changes and updates without the need for hardware changes.

Package Style (Meter): GRID ARRAY

The grid array package style offers high interconnection density, enabling efficient signal routing and reducing signal propagation delays, leading to improved performance of the FPGA.

Minimum Supply Voltage: 1.07 V

The low minimum supply voltage ensures reliable operation at lower power levels, contributing to the energy efficiency and overall reliability of the FPGA.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance makes this FPGA suitable for applications that require extended temperature range operation, ensuring reliable performance in harsh environmental conditions.

Pitch Of Terminal: 1 mm

The fine pitch of 1mm allows for high-density packaging and closer spacing of terminals, enabling compact and space-efficient integration of the FPGA onto circuit boards.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance ensures reliable operation even in cold environments, making the FPGA suitable for a wide range of temperature conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections in the FPGA.

Position Of Terminal: BOTTOM

Bottom terminals facilitate easy mounting and soldering of the FPGA onto circuit boards, making the assembly process efficient and hassle-free.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the FPGA has moderate sensitivity to moisture, requiring standard precautions during handling and storage to prevent moisture-related damage.

Maximum Seated Height: 2 mm

The low seated height of 2mm allows for compact and slim designs when integrating the FPGA onto circuit boards, saving space and enabling high-density packaging.

Width: 27 mm

The width of 27mm provides a compact form factor for the FPGA, enabling easy integration into tight spaces and efficient layout designs on circuit boards.

No. of Outputs: 368

With a high number of outputs, the FPGA can drive multiple external devices and interfaces, facilitating complex signal processing and data communication tasks in various applications.

Length: 27 mm

The length of 27mm complements the width and form factor of the FPGA, ensuring a balanced and space-efficient package size for easy integration into circuit board designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGTFD5C5F27C7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

76500

No. of Inputs:

368

No. of Outputs:

368

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5CGTFD5C5F27C7N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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