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5AGTFC3H3F27I3N

Intel

5AGTFC3H3F27I3N by Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: HBGA; Package Shape: SQUARE;

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2

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1k+

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Digiode

USA . 1,441 parts In-Stock

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Vyrian

USA . 1,213 parts In-Stock

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Ampacity Inc.

Singapore . 665 parts In-Stock

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$8.000

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$8.000

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Semicontronic

India . 807 parts In-Stock

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$18.000

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$17.550

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$17.460

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One Stop Electronics

USA . 524 parts In-Stock

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$22.000

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MARBEL Systems

Belgium . 489 parts In-Stock

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$37.800

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Texas Native Microelectronics

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$43.448

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$38.234

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Kenton Components

USA . 1,000 parts In-Stock

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$52.138

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$45.881

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Native Components

USA . 292 parts In-Stock

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$60.092

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$57.689

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Northwest PG Solutions

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Qasali Group International

UK . 27,015 parts In-Stock

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$125.815

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$110.717

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Corphita

USA . 561 parts In-Stock

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Corohmni

South Africa . 341 parts In-Stock

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Supply Digital

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Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGTFC3H3F27I3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

156000

No. of Inputs:

416

No. of Outputs:

416

No. of CLBs:

5890

Organization:

5890 CLBS

Power Characteristics

Nominal Supply Voltage:

1.15

Minimum Supply Voltage:

1.12 V

Maximum Supply Voltage:

1.18 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Trade Compliance

5AGTFC3H3F27I3N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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