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80HCPS1432RMI

Integrated Device Technology

80HCPS1432RMI by Integrated Device Technology

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 576; Package Code: HBGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 150 parts In-Stock

1+ parts

$0.173

100+ parts

-

1k+ parts

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10k+ parts

$0.166

150

$0.173

-

-

$0.166

Northwest PG Solutions

USA . 2,090 parts In-Stock

1+ parts

$0.190

100+ parts

-

1k+ parts

-

10k+ parts

$0.168

2,090

$0.190

-

-

$0.168

Component Stockers USA

USA . 270 parts In-Stock

1+ parts

$99.990

100+ parts

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1k+ parts

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10k+ parts

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270

$99.990

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

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Microchip USA

USA . 343 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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343

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Technical Specifications

Other Function Telecom Interface ICs 80HCPS1432RMI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Integrated Device Technology

Specs

JESD-30 Code:

S-PBGA-B576

JESD-609 Code:

e1

Length:

25 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

576

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.83 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Trade Compliance

80HCPS1432RMI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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