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71V65703S85BGG

Integrated Device Technology

71V65703S85BGG by Integrated Device Technology

ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Access Time: 8.5 ns;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,124 parts In-Stock

1+ parts

$66.027

100+ parts

-

1k+ parts

-

10k+ parts

-

2,124

$66.027

-

-

-

Robosynatics

Brazil . 2,000 parts In-Stock

1+ parts

-

100+ parts

$3.114

1k+ parts

$2.884

10k+ parts

$2.884

2,000

-

$3.114

$2.884

$2.884

Lucentia Tech

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$3.114

1k+ parts

$2.884

10k+ parts

$2.884

2,000

-

$3.114

$2.884

$2.884

Northwest PG Solutions

USA . 1,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,076

-

-

-

-

Native Components

USA . 754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

754

-

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-

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Technical Specifications

SRAM 71V65703S85BGG attributes and parameters. Explore more SRAM devices from Integrated Device Technology

Specs

Maximum Access Time:

8.5 ns

Additional Features:

FLOW-THROUGH

JESD-30 Code:

R-PBGA-B119

JESD-609 Code:

e1

Memory Density:

9437184 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

119

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX36

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

71V65703S85BGG Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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