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TLE9871QXA20XUMA2

Infineon Technologies

TLE9871QXA20XUMA2 by Infineon Technologies

TLE9871QXA20XUMA2 by Infineon with Cortex-M3 CPU, 32-bit, 25 MHz clock freq. Ideal for automotive apps with AEC-Q100 screening, LIN & UART connectivity, 5 ADC channels, and low power mode. Features integrated cache, 3072 RAM bytes, and flash ROM programmability.

Median Price

$3.862

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,490 parts In-Stock

1+ parts

$5.660

100+ parts

$3.631

1k+ parts

$3.266

10k+ parts

$3.174

2,490

$5.660

$3.631

$3.266

$3.174

Rochester

USA . 3,962 parts In-Stock

1+ parts

-

100+ parts

$2.940

1k+ parts

$2.630

10k+ parts

$2.470

3,962

-

$2.940

$2.630

$2.470

Verical

USA . 2,360 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.288

10k+ parts

$3.087

2,360

-

$3.862

$3.288

$3.087

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 302 parts In-Stock

1+ parts

$3.126

100+ parts

-

1k+ parts

-

10k+ parts

-

302

$3.126

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.220

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$6.220

-

-

-

Vyrian

USA . 2,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,177

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,536 parts In-Stock

1+ parts

$2.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,536

$2.800

-

-

-

Corphita

USA . 888 parts In-Stock

1+ parts

$2.961

100+ parts

-

1k+ parts

-

10k+ parts

-

888

$2.961

-

-

-

Modulus Dynamics

Lithuania . 2,522 parts In-Stock

1+ parts

$5.075

100+ parts

$4.872

1k+ parts

$4.669

10k+ parts

-

2,522

$5.075

$4.872

$4.669

-

Corohmni

South Africa . 497 parts In-Stock

1+ parts

$5.075

100+ parts

-

1k+ parts

-

10k+ parts

-

497

$5.075

-

-

-

Semicontronic

India . 2,505 parts In-Stock

1+ parts

$6.090

100+ parts

$5.938

1k+ parts

$5.907

10k+ parts

-

2,505

$6.090

$5.938

$5.907

-

Continental Prestige Electronics

USA . 6,266 parts In-Stock

1+ parts

$6.220

100+ parts

-

1k+ parts

-

10k+ parts

$6.096

6,266

$6.220

-

-

$6.096

Microchip USA

USA . 1,228 parts In-Stock

1+ parts

$20.510

100+ parts

$20.380

1k+ parts

$20.320

10k+ parts

$20.260

1,228

$20.510

$20.380

$20.320

$20.260

Aztec Data Supply Inc.

USA . 1,466 parts In-Stock

1+ parts

$69.070

100+ parts

-

1k+ parts

-

10k+ parts

-

1,466

$69.070

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,706

-

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,000

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

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Argo Parts USA

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,163

-

-

-

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

-

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-

-

Overview

Enhance your electronics projects with the TLE9871QXA20XUMA2 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you a top-quality microcontroller that is versatile and reliable. With integrated cache and a range of peripherals including PWM and timers, this microcontroller offers unbeatable value and flexibility for various applications. Whether you're working on automotive systems, industrial automation, or consumer electronics, the TLE9871QXA20XUMA2 delivers high performance and efficiency to meet your design needs. Elevate your projects with the trusted brand of Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Integrated Cache: YES

Integrated cache helps in improving the speed and performance of the microcontroller by storing frequently accessed data and instructions.

Maximum Supply Voltage: 28 V

High maximum supply voltage allows the microcontroller to operate in a wide range of applications without the risk of voltage fluctuations damaging the device.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures that the microcontroller offers a good balance between performance and power consumption, making it suitable for a wide range of applications.

ROM Words: 36864

Having a large ROM capacity allows the microcontroller to store a significant amount of program data and instructions, making it versatile for various applications.

Analog To Digital Convertors: 5-Ch 10-Bit

Multiple analog to digital converters with 10-bit resolution provide accurate and precise conversion of analog signals, making the microcontroller suitable for applications requiring analog inputs.

Low Power Mode: YES

Low power mode functionality helps in reducing power consumption when the microcontroller is not actively processing data, making it energy-efficient and ideal for battery-powered devices.

Technical Specifications

Microcontrollers TLE9871QXA20XUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

13

No. of External Interrupts:

2

No. of I/O Lines:

10

No. of Serial I/Os:

5

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

3072

ROM Words:

36864

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Speed:

24 rpm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

LIN, SSC(2), UART(2)

Peripherals:

BOR, DMA(13), POR, PWM, TIMER(4), WDT(2)

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

TLE9871QXA20XUMA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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