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IPW60R180P7XKSA1

Infineon Technologies

IPW60R180P7XKSA1 by Infineon Technologies

IPW60R180P7XKSA1 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 53A IDM, 56mJ EAS, and 0.18 ohm RDS(on). Package style is FLANGE MOUNT with TIN finish, suitable for ENHANCEMENT MODE operation at -55°C.

Median Price

$3.550

Lifecycle Status

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13

In-Stock Inventory

1k+

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Chip1Stop

Japan . 460 parts In-Stock

1+ parts

$3.400

100+ parts

$1.840

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460

$3.400

$1.840

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Element14

Singapore . 29 parts In-Stock

1+ parts

$3.701

100+ parts

$1.961

1k+ parts

$1.791

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29

$3.701

$1.961

$1.791

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Newark

USA . 140 parts In-Stock

1+ parts

$3.920

100+ parts

$2.030

1k+ parts

$1.820

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140

$3.920

$2.030

$1.820

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Mouser Electronics

USA . 28,960 parts In-Stock

1+ parts

$3.950

100+ parts

$1.870

1k+ parts

$1.550

10k+ parts

$1.360

28,960

$3.950

$1.870

$1.550

$1.360

Farnell

UK . 29 parts In-Stock

1+ parts

$3.972

100+ parts

$1.885

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$1.733

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29

$3.972

$1.885

$1.733

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Verical

USA . 156,960 parts In-Stock

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$2.274

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$2.274

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Rochester

USA . 507 parts In-Stock

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$1.600

1k+ parts

$1.330

10k+ parts

$1.180

507

-

$1.600

$1.330

$1.180

RS (Exports)

UK . 140 parts In-Stock

1+ parts

-

100+ parts

$2.680

1k+ parts

$2.284

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140

-

$2.680

$2.284

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Distributors (In-Stock)

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Digiode

USA . 322 parts In-Stock

1+ parts

$1.434

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322

$1.434

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Vyrian

USA . 3,644 parts In-Stock

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3,644

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Rutronik

Germany . 2,700 parts In-Stock

1+ parts

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100+ parts

$1.740

1k+ parts

$1.430

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2,700

-

$1.740

$1.430

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IBS Electronics

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$2.006

1k+ parts

$1.837

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240

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$2.006

$1.837

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Nova Conductors

Japan . 33 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,645 parts In-Stock

1+ parts

$0.530

100+ parts

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1,645

$0.530

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Corohmni

South Africa . 483 parts In-Stock

1+ parts

$0.586

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483

$0.586

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Modulus Dynamics

Lithuania . 23,184 parts In-Stock

1+ parts

$0.636

100+ parts

$0.611

1k+ parts

$0.585

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23,184

$0.636

$0.611

$0.585

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Ampacity Inc.

Singapore . 17,932 parts In-Stock

1+ parts

$1.280

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17,932

$1.280

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Semicontronic

India . 15,744 parts In-Stock

1+ parts

$1.280

100+ parts

$1.248

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$1.242

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15,744

$1.280

$1.248

$1.242

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Corphita

USA . 28 parts In-Stock

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$1.359

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28

$1.359

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Microchip USA

USA . 5,498 parts In-Stock

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$27.885

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5,498

$27.885

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QUARKTWIN TECHNOLOGY LTD

USA . 8,334 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 1,243 parts In-Stock

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Continental Prestige Electronics

USA . 1,096 parts In-Stock

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Argo Parts USA

USA . 542 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Enhance your power management solutions with the IPW60R180P7XKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors for various switching applications. With a high breakdown voltage of 600V and a built-in diode, this N-Channel transistor offers exceptional performance and reliability. Its low on-resistance of 0.18 ohm ensures efficient operation, while the maximum pulsed drain current of 53A provides robust power handling capabilities. Trust in Infineon to deliver cutting-edge technology that meets your power management needs effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the FET, ensuring a longer product lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and fast switching between ON and OFF states.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications with safety and reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, essential in many circuit designs.

Avalanche Energy Rating (EAS): 56 mJ

High avalanche energy rating ensures the FET can withstand transient voltage spikes without damage.

Maximum Pulsed Drain Current (IDM): 53 A

High pulsed drain current rating allows for handling transient current spikes effectively.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a sturdy connection to the circuit board, offering reliability in various environmental conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and require no bias voltage to operate, simplifying circuit design.

No. of Terminals: 3

Three terminals provide the necessary connections for power, control, and grounding, making it versatile for different circuit configurations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in switching applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its efficiency and stability in electronic devices.

Minimum Operating Temperature: -55 °C

Capable of operating in harsh environments with low temperatures, suitable for industrial and automotive applications.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance, ensuring long-term reliability in various operating conditions.

Maximum Drain-Source On Resistance: 0.18 ohm

Low ON resistance minimizes power loss and heat generation, improving efficiency in power switching applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, reducing the risk of wiring errors.

Technical Specifications

Power Field Effect Transistors (FET) IPW60R180P7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

56 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

53 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW60R180P7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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