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XMC4800F144K1024AAXQMA1

Infineon Technologies

XMC4800F144K1024AAXQMA1 by Infineon Technologies

Infineon XMC4800F144K1024AAXQMA1 is a 32-bit microcontroller with 144 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 204800 bytes of RAM, 1048576 ROM words, and connectivity options like CAN, Ethernet, and USB.

Median Price

$17.940

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 349 parts In-Stock

1+ parts

$17.940

100+ parts

$12.880

1k+ parts

-

10k+ parts

-

349

$17.940

$12.880

-

-

Newark

USA . 336 parts In-Stock

1+ parts

$23.530

100+ parts

$16.790

1k+ parts

$16.230

10k+ parts

-

336

$23.530

$16.790

$16.230

-

DigiKey

USA . 357 parts In-Stock

1+ parts

$26.790

100+ parts

$19.116

1k+ parts

$17.477

10k+ parts

-

357

$26.790

$19.116

$17.477

-

Verical

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$16.325

1k+ parts

$14.613

10k+ parts

$13.750

180

-

$16.325

$14.613

$13.750

Rochester

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$13.060

1k+ parts

$11.690

10k+ parts

$11.000

180

-

$13.060

$11.690

$11.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 53 parts In-Stock

1+ parts

$13.571

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$13.571

-

-

-

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$19.079

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$19.079

-

-

-

Vyrian

USA . 3,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,191

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 27 parts In-Stock

1+ parts

$12.140

100+ parts

$11.836

1k+ parts

$11.776

10k+ parts

-

27

$12.140

$11.836

$11.776

-

Ampacity Inc.

Singapore . 16 parts In-Stock

1+ parts

$12.140

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$12.140

-

-

-

Corphita

USA . 867 parts In-Stock

1+ parts

$12.856

100+ parts

-

1k+ parts

-

10k+ parts

-

867

$12.856

-

-

-

Aztec Data Supply Inc.

USA . 3,458 parts In-Stock

1+ parts

$17.480

100+ parts

-

1k+ parts

-

10k+ parts

-

3,458

$17.480

-

-

-

Corohmni

South Africa . 260 parts In-Stock

1+ parts

$17.911

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$17.911

-

-

-

Continental Prestige Electronics

USA . 893 parts In-Stock

1+ parts

$19.079

100+ parts

-

1k+ parts

-

10k+ parts

$18.698

893

$19.079

-

-

$18.698

Modulus Dynamics

Lithuania . 2,915 parts In-Stock

1+ parts

$46.151

100+ parts

$44.305

1k+ parts

$42.459

10k+ parts

-

2,915

$46.151

$44.305

$42.459

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Argo Parts USA

USA . 1,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,445

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$18.698

1k+ parts

$18.125

10k+ parts

$17.744

1,000

-

$18.698

$18.125

$17.744

Overview

Unlock the power of cutting-edge technology with the XMC4800F144K1024AAXQMA1 by Infineon Technologies. This high-quality microcontroller is designed to deliver top-notch performance and reliability in a wide range of applications. With features such as advanced peripherals, automotive-grade temperature tolerance, and a powerful 32-bit architecture, this product offers unparalleled value to customers looking for innovative solutions. Whether you're in the automotive industry, IoT sector, or industrial automation field, the XMC4800F144K1024AAXQMA1 is the perfect choice for taking your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is lightweight and durable, making it ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration onto circuit boards.

Maximum Supply Voltage: 3.63 V

Allows for a wide range of input voltage options, increasing versatility in different applications.

Package Shape: SQUARE

Square shape offers efficient use of space on circuit boards.

Bit Size: 32

32-bit architecture enables faster processing and higher performance capabilities.

DAC Channels: YES

Digital-to-analog converter channels allow for conversion of digital signals into analog outputs, expanding connectivity options.

No. of Terminals: 144

Ample number of terminals provide flexibility for connecting to various peripherals and components.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Multiple package styles offer versatility in mounting and heat dissipation options.

Minimum Supply Voltage: 3.13 V

Provides a reliable lower limit for input voltage, ensuring stable operation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for use in harsh environments without risking damage.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables use in extreme cold conditions.

Terminal Finish: TIN

Tin finish offers good solderability and corrosion resistance for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels facilitate conversion of analog signals into digital data for processing.

DMA Channels: YES

Direct memory access channels enhance data transfer speeds and efficiency in handling multiple tasks simultaneously.

Terminal Position: QUAD

Quad terminal position enables efficient routing of signals and reduces electromagnetic interference.

ROM Words: 1048576

Large ROM capacity allows for storing extensive program code and data.

Maximum Seated Height: 1.6 mm

Low seated height provides space-saving advantages for compact device designs.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual-channel 12-bit DACs offer precise analog output capabilities for various applications.

Width: 20 mm

Compact width dimension allows for integration into tight spaces or small form factor devices.

Peripherals: CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2), SCU, RTC, WDT

Wide range of peripherals enhance connectivity options and functional capabilities for diverse applications.

Maximum Clock Frequency: 40 MHz

High clock frequency enables rapid data processing and execution of complex tasks.

Length: 20 mm

Compact length dimension for efficient use of board space.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and durability in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions in a microcontroller environment.

RAM Bytes: 204800

Generous RAM capacity provides sufficient memory for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy assembly onto circuit boards and ensures secure connections.

Analog To Digital Convertors: 32-Ch 12-Bit

Thirty-two-channel 12-bit ADCs offer versatile analog input capabilities for sensor interfacing and data acquisition.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard voltage levels.

Connectivity: CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Extensive connectivity options enable integration with various communication protocols and interfaces for versatile applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updating of firmware and applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates device can withstand standard reflow soldering processes without damage from moisture absorption.

Speed: 144 rpm

High-speed performance at 144 revolutions per minute for efficient data processing and system operation.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM for storing and executing program instructions efficiently.

No. of I/O Lines: 117

Abundant I/O lines offer flexibility in connecting to external devices and peripherals for enhanced functionality.

Technical Specifications

Microcontrollers XMC4800F144K1024AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

117

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

204800

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Peripherals:

CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2) ,SCU, RTC, WDT

Analog To Digital Convertors:

32-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4800F144K1024AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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