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XMC4400F64F512ABXQMA1

Infineon Technologies

XMC4400F64F512ABXQMA1 by Infineon Technologies

Infineon XMC4400F64F512ABXQMA1 is a 32-bit microcontroller with 40 MHz clock frequency, 81920 bytes RAM, and 524288 ROM words. It features 14-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and peripherals like CAN(2) and ETHERNET. Ideal for industrial applications requiring high-speed processing and connectivity in a compact form factor.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

USA . 875 parts In-Stock

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Singapore . 200 parts In-Stock

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AZTECH Wire

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$16.020

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Corohmni

South Africa . 706 parts In-Stock

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$27.090

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Modulus Dynamics

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$29.733

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$28.544

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$27.354

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$28.544

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Aztec Data Supply Inc.

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$33.628

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Component Stockers USA

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Argo Parts USA

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Overview

Unlock the full potential of your next project with the XMC4400F64F512ABXQMA1 Microcontroller by Infineon Technologies. This cutting-edge device offers unparalleled quality and performance, making it a top choice for a wide range of applications. With its advanced features and impressive specifications, this microcontroller provides customers with unmatched value, benefits, and advantages. Trust Infineon Technologies to deliver innovative solutions that meet and exceed your expectations. Elevate your designs with the XMC4400F64F512ABXQMA1 Microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable yet lightweight, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.63 V

Supports a maximum supply voltage of 3.63 V, providing stability and versatility in power input.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement in designs.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capabilities.

DAC Channels: YES

Digital to Analog Converters allow for accurate conversion of digital signals to analog for various applications.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for interfacing with other devices.

Minimum Supply Voltage: 3.13 V

Supports a minimum supply voltage of 3.13 V, ensuring reliable operation even at lower power inputs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller is suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in temperatures as low as -40°C, making it ideal for a wide range of operating environments.

ADC Channels: YES

Analog to Digital Converters allow for precise conversion of analog signals to digital, expanding the range of applications this microcontroller can be used in.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position allows for easy and organized connection of external components.

ROM Words: 524288

With a large ROM capacity of 524288 words, this microcontroller can store a wide range of program instructions and data.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm allows for compact and space-efficient designs.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit Digital to Analog Converters provide accurate analog output for precise control and signal generation.

Width: 10 mm

Compact width of 10 mm enables tight integration in small electronic devices and systems.

Peripherals: DMA(8), DTS, LEDTS, POR, PWM, RTC, TIMER(5), WDT

Various peripherals including DMA, PWM, RTC, and timers enhance the functionality and versatility of this microcontroller.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz enables fast processing and response times.

Length: 10 mm

Compact length of 10 mm complements the width for efficient board space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers efficient processing and reduced power consumption.

RAM Bytes: 81920

Generous RAM capacity of 81920 bytes facilitates data storage and manipulation for complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

Gull wing terminal form allows for secure and reliable solder connections.

Analog To Digital Convertors: 14-Ch 12-Bit

Fourteen 12-bit Analog to Digital Converters provide precise digital representation of analog signals for accurate measurements and control.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V ensures compatibility with common power sources and stable operation.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals for applications such as motor control and power management.

Connectivity: CAN(2), ETHERNET, USIC(4)

Connectivity options including CAN, Ethernet, and USIC interfaces expand the possibilities for networking and communication in embedded systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the program code without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and compact board designs.

Speed: 120 rpm

Operating speed of 120 rpm provides fast data processing and response times for real-time applications.

On Chip Program ROM Width: 8

8-bit width of the on-chip program ROM accommodates a wide range of instructions and data for program execution.

No. of I/O Lines: 40

With 40 Input/Output lines, this microcontroller offers versatile connectivity options for interfacing with sensors, actuators, and external devices.

Technical Specifications

Microcontrollers XMC4400F64F512ABXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

40

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

81920

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, USIC(4)

Peripherals:

DMA(8), DTS, LEDTS, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4400F64F512ABXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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