Loading...

XC2299H200F100LABKXUMA1

Infineon Technologies

XC2299H200F100LABKXUMA1 by Infineon Technologies

Infineon's XC2299H200F100LABKXUMA1 is a 32-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 176 terminals, PWM channels, and ADC channels for precise control in a compact package style.

Median Price

$22.725

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 427 parts In-Stock

1+ parts

-

100+ parts

$22.725

1k+ parts

$20.337

10k+ parts

$19.137

427

-

$22.725

$20.337

$19.137

Rochester

USA . 402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

402

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 968 parts In-Stock

1+ parts

$19.218

100+ parts

-

1k+ parts

-

10k+ parts

-

968

$19.218

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$24.753

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$24.753

-

-

-

Vyrian

USA . 5,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,658

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 671 parts In-Stock

1+ parts

$13.455

100+ parts

-

1k+ parts

-

10k+ parts

-

671

$13.455

-

-

-

Ampacity Inc.

Singapore . 326 parts In-Stock

1+ parts

$17.200

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$17.200

-

-

-

Corphita

USA . 905 parts In-Stock

1+ parts

$18.207

100+ parts

-

1k+ parts

-

10k+ parts

-

905

$18.207

-

-

-

Modulus Dynamics

Lithuania . 636 parts In-Stock

1+ parts

$23.430

100+ parts

$22.493

1k+ parts

$21.556

10k+ parts

-

636

$23.430

$22.493

$21.556

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$24.753

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$24.753

-

-

-

Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$44.007

100+ parts

$40.046

1k+ parts

$36.086

10k+ parts

-

700

$44.007

$40.046

$36.086

-

Microchip USA

USA . 1,656 parts In-Stock

1+ parts

$48.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,656

$48.540

-

-

-

Component Stockers USA

USA . 567 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

567

$99.990

-

-

-

Overview

Unlock endless possibilities with the XC2299H200F100LABKXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality microcontrollers that are versatile and reliable. From automotive to industrial applications, this microcontroller offers unmatched value and performance. Say goodbye to limitations and hello to innovation with the XC2299H200F100LABKXUMA1. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the microcontroller easy to handle and resistant to damage during handling or operation.

Surface Mount: YES

Surface mount design allows for easier and more efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.6 V

Operating at a maximum supply voltage of 1.6V allows for efficient power usage and helps prevent overheating or damage to the microcontroller.

Address Bus Width: 24

With a wide address bus width of 24, the microcontroller can handle larger amounts of memory and data, making it suitable for complex applications.

Bit Size: 32

Having a 32-bit architecture allows for faster processing speeds, higher performance, and better overall efficiency of the microcontroller.

No. of Terminals: 176

Having a high number of terminals provides ample connectivity options for interfacing with other devices or components, making the microcontroller versatile and adaptable.

Minimum Supply Voltage: 1.4 V

Operating at a minimum supply voltage of 1.4V ensures that the microcontroller can still function efficiently even under low power conditions, increasing its reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the microcontroller can withstand harsh environmental conditions and operate reliably in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

Having a low minimum operating temperature of -40°C enables the microcontroller to function in cold environments without compromising its performance or durability.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and corrosion resistance, ensuring stable connections and long-term reliability of the microcontroller.

ADC Channels: YES

Having ADC channels allows the microcontroller to efficiently convert analog signals into digital data, enabling precise and accurate measurements in various applications.

Maximum Seated Height: 1.6 mm

With a low maximum seated height of 1.6mm, the microcontroller can be easily integrated into compact designs or tight spaces without adding bulk or complexity.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller provides high performance, low power consumption, and efficient execution of instructions, making it ideal for embedded systems and IoT applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, ensuring optimal performance and efficiency of the microcontroller.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5V ensures stable and consistent power delivery to the microcontroller, preventing voltage fluctuations and enhancing its overall performance.

PWM Channels: YES

Having PWM channels allows the microcontroller to generate precise and adjustable pulse-width modulation signals, which are essential for controlling motors, LEDs, and other devices accurately.

Technical Specifications

Microcontrollers XC2299H200F100LABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

147

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

XC2299H200F100LABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20