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XC2267M104F80LAAKXUMA1

Infineon Technologies

XC2267M104F80LAAKXUMA1 by Infineon Technologies

Infineon's XC2267M104F80LAAKXUMA1 is a 32-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Designed for automotive applications, it features 74 I/O lines, PWM channels, and ADC channels. The microcontroller has a low profile flatpack package with a terminal pitch of 0.5 mm and operates in temperatures ranging from -40°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,442 parts In-Stock

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4,442

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Digiode

USA . 658 parts In-Stock

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658

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Distributors (Availability)

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AZTECH Wire

Italy . 707 parts In-Stock

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$6.459

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707

$6.459

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Ampacity Inc.

Singapore . 738 parts In-Stock

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$24.000

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738

$24.000

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Aztec Data Supply Inc.

USA . 2,708 parts In-Stock

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$30.560

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$30.560

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Semicontronic

India . 1,029 parts In-Stock

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$31.000

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$30.225

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$30.070

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1,029

$31.000

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$30.070

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Corohmni

South Africa . 683 parts In-Stock

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$61.988

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683

$61.988

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Modulus Dynamics

Lithuania . 2,308 parts In-Stock

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$71.173

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$68.326

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$65.479

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2,308

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$65.479

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QUARKTWIN TECHNOLOGY LTD

USA . 28,696 parts In-Stock

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Continental Prestige Electronics

USA . 5,156 parts In-Stock

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Microchip USA

USA . 4,314 parts In-Stock

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Argo Parts USA

USA . 2,466 parts In-Stock

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Corphita

USA . 447 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your automotive applications with the XC2267M104F80LAAKXUMA1 microcontroller by Infineon Technologies. Delivering top-notch quality and reliability, this product is designed to optimize performance in a wide range of scenarios. With advanced features like flash ROM programmability and PWM channels, customers can expect seamless integration and enhanced functionality. Trust in Infineon's expertise in microcontrollers, and unlock the full potential of your projects with the XC2267M104F80LAAKXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and simplifying assembly.

Maximum Supply Voltage: 1.6 V

Allows for a wide range of power supply options while staying within safe operating limits.

Address Bus Width: 24

Allows for a large memory address space, ideal for handling complex applications and data processing.

Package Shape: SQUARE

Facilitates easy integration into a circuit design and offers uniformity in layout.

Bit Size: 32

Provides sufficient processing power for handling a variety of tasks and calculations efficiently.

No. of Terminals: 100

Offers a good number of connection points for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Optimizes space utilization, promotes heat dissipation, and enables high-density PCB designs.

Minimum Supply Voltage: 1.4 V

Supports low-power operation while maintaining stable performance levels.

Maximum Operating Temperature: 125 °C

Ensures reliable operation in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Allows the microcontroller to function in extreme cold temperatures without any issues.

Terminal Finish: MATTE TIN

Provides corrosion resistance and ensures good electrical conductivity for reliable connections.

ADC Channels: YES

Enables the microcontroller to interface with analog sensors and signals for versatile input processing.

Terminal Position: QUAD

Facilitates easy soldering and connection of the microcontroller to the PCB.

Maximum Seated Height: 1.6 mm

Allows for a compact design and efficient use of space in the final product.

Width: 14 mm

Offers a good balance between size and versatility for accommodating the microcontroller in various applications.

External Data Bus Width: 16

Supports high-speed data transfer and efficient communication with external devices.

Maximum Clock Frequency: 40 MHz

Provides fast processing speeds for handling complex algorithms and real-time operations.

Length: 14 mm

Maintains a square form factor for easy integration and uniform placement on the PCB.

Temperature Grade: AUTOMOTIVE

Certified for automotive applications, ensuring reliable performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for efficient execution of commands and tasks.

Technology: CMOS

Provides low power consumption and fast operation, making the microcontroller energy-efficient and responsive.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the PCB, ensuring reliable electrical connections.

Nominal Supply Voltage: 1.5 V

Ideal operating voltage for stable and efficient performance of the microcontroller.

PWM Channels: YES

Allows for precise control of analog outputs, essential for applications like motor control and lighting systems.

ROM Programmability: FLASH

Enables easy and quick reprogramming of the microcontroller's memory for flexibility in application development.

Terminal Pitch: 0.5 mm

Provides a fine pitch for the terminals, allowing for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

Indicates the microcontroller's sensitivity to moisture during storage and handling, ensuring proper precautions are taken.

Speed: 80 rpm

Represents the rotational speed of the microcontroller, suitable for various real-time control applications.

No. of I/O Lines: 74

Offers a sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing flexibility.

Technical Specifications

Microcontrollers XC2267M104F80LAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3V TO 5.5V I/O SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XC2267M104F80LAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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