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XC226796F80LACKXUMA1

Infineon Technologies

XC226796F80LACKXUMA1 by Infineon Technologies

Infineon's XC226796F80LACKXUMA1 is a 32-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 73 I/O lines, PWM channels, and ADC channels. With a temperature range of -40 to 125°C and low profile design, it suits various automotive electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,363 parts In-Stock

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Chip Stock

USA . 7,100 parts In-Stock

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7,100

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Digiode

USA . 489 parts In-Stock

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489

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Nova Conductors

Japan . 17 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,477 parts In-Stock

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$15.000

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1,477

$15.000

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AZTECH Wire

Italy . 834 parts In-Stock

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$16.157

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834

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Corohmni

South Africa . 183 parts In-Stock

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$16.308

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183

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Semicontronic

India . 1,639 parts In-Stock

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$25.000

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$24.375

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$24.250

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1,639

$25.000

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$24.250

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Microchip USA

USA . 2,328 parts In-Stock

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$39.355

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$39.355

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Modulus Dynamics

Lithuania . 2,710 parts In-Stock

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$52.129

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$50.044

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$47.959

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2,710

$52.129

$50.044

$47.959

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Aztec Data Supply Inc.

USA . 1,129 parts In-Stock

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$69.850

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Continental Prestige Electronics

USA . 4,504 parts In-Stock

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Argo Parts USA

USA . 3,989 parts In-Stock

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Corphita

USA . 231 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the power of innovation with the XC226796F80LACKXUMA1 by Infineon Technologies. This cutting-edge microcontroller offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. From automotive systems to industrial automation, this versatile device delivers superior performance and efficiency. With Infineon's reputation for excellence in manufacturing, you can trust that you're getting a product that will exceed your expectations. Experience the value and benefits of the XC226796F80LACKXUMA1 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring longer lifespan and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and cost during manufacturing.

Maximum Supply Voltage: 1.6 V

With a maximum supply voltage of 1.6 V, this microcontroller is suitable for low power applications, helping to conserve energy.

Address Bus Width: 24

A wider address bus width of 24 allows for efficient memory addressing and data retrieval, enhancing overall performance.

Package Shape: SQUARE

Square package shape provides easy integration into circuit designs, optimizing space utilization on the PCB.

Bit Size: 32

32-bit architecture offers higher processing capability and performance for complex tasks and applications.

No. of Terminals: 100

Having 100 terminals enables connectivity to various external components and peripherals, enhancing functionality and versatility.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Different package styles offer flexibility in design options and suitability for diverse applications and environments.

Minimum Supply Voltage: 1.4 V

Low minimum supply voltage of 1.4 V allows for operation in power-constrained scenarios while maintaining stability.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance of 125 °C ensures reliable performance in extreme environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range of -40 °C enables operation in cold environments without compromising functionality.

Terminal Finish: TIN

TIN terminal finish offers good conductivity and corrosion resistance, ensuring reliable electrical connections.

ADC Channels: YES

Presence of ADC channels allows for analog signal conversion, enabling compatibility with a wide range of sensors and inputs.

Terminal Position: QUAD

Quad terminal position layout facilitates easy PCB mounting and soldering, simplifying assembly and maintenance processes.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm minimizes space requirements and allows for compact designs in constrained applications.

Width: 14 mm

A width of 14 mm offers a balance between space efficiency and component integration, making it suitable for various board sizes.

External Data Bus Width: 16

16-bit external data bus width enables faster data transfer and processing speeds, improving overall system performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz allows for rapid execution of instructions and tasks, enhancing real-time processing capabilities.

Length: 14 mm

A length of 14 mm offers a compact form factor, ideal for applications where space is limited or miniaturization is required.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in automotive applications, where temperature variations are common.

Peripheral IC Type: MICROCONTROLLER

Inclusion of various peripheral ICs enhances the microcontroller's functionality for diverse application requirements, such as communication interfaces and timer units.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical support and easy soldering during PCB assembly, ensuring strong and reliable connections.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage of 1.5 V ensures consistent and reliable operation of the microcontroller across different operating conditions.

PWM Channels: YES

Availability of PWM channels allows for precise control of motor speeds, LED brightness, and other analog signal modulation applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for firmware updates and modifications, enhancing the microcontroller's versatility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting on PCBs, improving spatial efficiency and enabling miniaturization in compact designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage during assembly and use.

Speed: 80 rpm

Operating speed of 80 rpm allows for efficient data processing and execution, meeting the performance demands of various applications.

No. of I/O Lines: 73

73 I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's functionality and versatility in system integration.

Technical Specifications

Microcontrollers XC226796F80LACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XC226796F80LACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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